FN4315.16 November 4, 2005 HIN202E, HIN206E, HIN207E, HIN208E, HIN211E, HIN213E, HIN232E Small Outline Plastic Packages (SSOP) NO" />
參數(shù)資料
型號(hào)： HIN207ECB-T
廠商： Intersil
文件頁(yè)數(shù)： 9/22頁(yè)
文件大?。?/td> 0K
描述： IC 5DRVR/3RCVR RS232 5V 24-SOIC
標(biāo)準(zhǔn)包裝： 1,000
類(lèi)型： 收發(fā)器
驅(qū)動(dòng)器/接收器數(shù)： 5/3
規(guī)程： RS232
電源電壓： 4.75 V ~ 5.25 V
安裝類(lèi)型： 表面貼裝
封裝/外殼： 24-SOIC（0.295"，7.50mm 寬）
供應(yīng)商設(shè)備封裝： 24-SOIC
包裝： 帶卷 (TR)
17
FN4315.16
November 4, 2005
HIN202E, HIN206E, HIN207E, HIN208E, HIN211E, HIN213E, HIN232E
Small Outline Plastic Packages (SSOP)
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.20mm (0.0078
inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Interlead
flash and protrusions shall not exceed 0.20mm (0.0078 inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “B” does not include dambar protrusion. Allowable dambar
protrusion shall be 0.13mm (0.005 inch) total in excess of “B” dimen-
sion at maximum material condition.
10. Controlling dimension: MILLIMETER. Converted inch dimensions are
not necessarily exact.
INDEX
AREA
E
D
N
12
3
-B-
0.25(0.010)
C A
M
BS
e
-A-
L
B
M
-C-
A1
A
SEATING PLANE
0.10(0.004)
C
H
0.25(0.010)
B
M
α
0.25
0.010
GAUGE
PLANE
A2
M16.209 (JEDEC MO-150-AC ISSUE B)
16 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
-
0.078
-
2.00
-
A1
0.002
-
0.05
-
A2
0.065
0.072
1.65
1.85
-
B
0.009
0.014
0.22
0.38
9
C
0.004
0.009
0.09
0.25
-
D
0.233
0.255
5.90
6.50
3
E
0.197
0.220
5.00
5.60
4
e
0.026 BSC
0.65 BSC
-
H
0.292
0.322
7.40
8.20
-
L
0.022
0.037
0.55
0.95
6
N16
16
7
α
0°
8°
0°
8°
-
Rev. 3 6/05
相關(guān)PDF資料
PDF描述
HIN207ECB IC 5DRVR/3RCVR RS232 5V 24-SOIC
HIN207ECA-T IC 5DRVR/3RCVR RS232 5V 24-SSOP
HIN207CB-T IC 5DRVR/3RCVR RS232 5V 24-SO
HIN207CB IC 5DRVR/3RCVR RS232 5V 24-SO
HIN207CA IC 5DRVR/3RCVR RS232 5V 24-SSOP
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
HIN207ECBZ 功能描述:RS-232接口集成電路 RS232 5V 5D/3R 15KV 24 COM RoHS:否 制造商:Exar 數(shù)據(jù)速率:52 Mbps 工作電源電壓:5 V 電源電流:300 mA 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:LQFP-100 封裝:
HIN207ECBZ-T 功能描述:RS-232接口集成電路 RS232 5V 5D/3R 15KV 24 COM RoHS:否 制造商:Exar 數(shù)據(jù)速率:52 Mbps 工作電源電壓:5 V 電源電流:300 mA 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:LQFP-100 封裝:
HIN207ECP 制造商:Rochester Electronics LLC 功能描述:- Bulk
HIN207EIA 制造商:Rochester Electronics LLC 功能描述:RS232 5V 5D/3R 15KV 24SSOP IND - Bulk
HIN207EIA-T 制造商:Rochester Electronics LLC 功能描述:- Bulk
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