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參數(shù)資料
| 型號(hào)： | HMMC-5027 |
| 廠商： | AGILENT TECHNOLOGIES INC |
| 元件分類： | 放大器 |
| 英文描述： | 2000 MHz - 26500 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| 封裝： | 0.1173 X 0.0303 INCH, 0.0056 INCH HEIGHT, DIE |
| 文件頁數(shù)： | 4/7頁 |
| 文件大?。?/td> | 542K |
| 代理商： | HMMC-5027 |
4
Figure 3. Assembly Diagram (For 2.0-26.5 GHz Operation)
1.5 mil dia Gold Wire
Bond to ≥15 nF DC Feedthru
1.5 mil dia Gold Wire
Bond to ≥ 15 nF DC Feedthru
Gold
Plated
Shim
2.0 mil
nom.
gap
2.0 mil
nom. gap
VDD
TC702
IN
VG1
OUT
≥68 pF Chip Capacitor
Input & Output Thin Film
Circuit w/≥ 8 pF
DC Blocking Capacitor
4 nH Inductor
1.0 mil Gold Wire Bond
(Length S200 mils)
Trace Offset
168 m
(6.6 mils)
Trace Offset
168 m
(6.6 mils)
Bonding Island
0.7 mil dia. Gold Bond Wire
(Length NOT important)
Note:
Total offset between RF input and
RF output pad is 335 m (13.2 mils).
VDD
(VDD & Aux Drain Pads)
(VG2 Pad)
(RF Input Pad)
(RF Output Pad)
Aux
Drain
RF
Input
770
(±10)
2980
(±10)
770
555
285
75
70
2900
Chip ID No.
Aux Gate
Notes
All dimensions in microns.
Rectangular Pad Dim: 75 x 75 m
Octagonal Pad Dim.: 90 m dia.
All other dimensions:
±5 m (unless otherwise noted).
RF Output
VG2
70
2290
2580
2900
VG1
465
220
0
Figure 2. Bond Pad Locations
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PDF描述 |
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| HMMC-5032 | 17700 MHz - 32000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER |
| HMMC-5032 | 17700 MHz - 32000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER |
| HMMC-5033 | 17700 MHz - 32000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER |
| HMMC-5038 | 37000 MHz - 40000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| HMMC-5040 | 20000 MHz - 40000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
相關(guān)代理商/技術(shù)參數(shù) |
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|---|---|
| HMMC-5032 | 制造商:Agilent Technologies 功能描述:RF AMP MOD SGL PWR AMP 32GHZ 5V - Gel-pak, waffle pack, wafer, diced wafer on film |
| HMMC-5033 | 制造商:Agilent Technologies 功能描述:RF AMP MOD SGL PWR AMP 32GHZ 5V - Gel-pak, waffle pack, wafer, diced wafer on film |
| HMMC-5034 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:37-43 GHz Amplifier |
| HMMC-5038 | 制造商:AGILENT 制造商全稱:AGILENT 功能描述:38 GHz LNA |
| HMMC-5040 | 制造商:Agilent Technologies 功能描述:RF AMP CHIP SGL GP 40GHZ 5V - Gel-pak, waffle pack, wafer, diced wafer on film |
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