參數(shù)資料
型號: HSMG-L640
英文描述: Surface Mount Lensed Chip LEDs(表貼型透鏡LED芯片)
中文描述: 表面貼裝芯片LED透鏡(表貼型透鏡的LED芯片)
文件頁數(shù): 7/8頁
文件大小: 167K
代理商: HSMG-L640
7
Figure 9. Reel Dimensions.
Figure 10. Tape Dimensions.
Figure 11. Tape Leader and Trailer Dimensions.
2 ± 0.5
11.4 ± 1.0
9 ± 0.3
60– 0
13.0 ± 0.2
21 ± 0.8
180– 3
END
START
THERE SHALL BE A
MINIMUM OF 40 mm
OF EMPTY COMPONENT
POCKETS SEALED WITH
COVER TAPE.
MOUNTED WITH
COMPONENTS
THERE SHALL BE A
MINIMUM OF 40 mm
OF EMPTY COMPONENT
POCKETS SEALED WITH
COVER TAPE.
150 mm-360 mm
MAY CONSIST
OF CARRIER
AND/OR
COVER TAPE.
8 ± 0.3
3.35 ± 0.1
3.5 ± 0.05
1.75 ± 0.1
1.8
4 ± 0.1
2 ± 0.05
4 ± 0.1
1.5
CATHODE
CENTER HOLE
+ 0.1
0
0.2 ± 0.05
1.7 ± 0.1
USER DIRECTION
OF FEED
Storage Condition: 5 to 30 C
@ 60% RH max.
Baking is required under the
condition:
a) the blue silica gel indicator
becoming white/transparent color
b) the pack has been opened for
more than 1 week
Baking recommended condition:
60 +/– 5C for 20 hours.
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