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參數資料
| 型號： | HSMS-280A |
| 英文描述： | Surface Mount RF Schottky Diodes in SOT-323(表貼型射頻肖特基二極管（SOT-323封裝）) |
| 中文描述： | 表面貼裝射頻肖特基二極管的SOT - 323（表貼型射頻肖特基二極管（采用SOT - 323封裝）） |
| 文件頁數： | 4/6頁 |
| 文件大?。?/td> | 58K |
| 代理商： | HSMS-280A |
4
Assembly Instructions
SOT-323 PCB Footprint
A recommended PCB pad layout
for the miniature SOT-323 (SC-70)
package is shown in Figure 11
(dimensions are in inches). This
layout provides ample allowance
for package placement by auto-
mated assembly equipment
without adding parasitics that
could impair the performance.
0.026
0.035
0.07
0.016
Figure 11. PCB Pad Layout
( dimensions in inches) .
SMT Assembly
Reliable assembly of surface
mount components is a complex
process that involves many
material, process, and equipment
factors, including: method of
heating (e.g., IR or vapor phase
reflow, wave soldering, etc.)
circuit board material, conductor
thickness and pattern, type of
solder alloy, and the thermal
conductivity and thermal mass of
components. Components with a
low mass, such as the SOT-323
package, will reach solder reflow
temperatures faster than those
with a greater mass.
HP’s SOT-323 diodes have been
qualified to the time-temperature
profile shown in Figure 12. This
profile is representative of an IR
reflow type of surface mount
assembly process.
After ramping up from room
temperature, the circuit board
with components attached to it
(held in place with solder paste)
passes through one or more
preheat zones. The preheat zones
increase the temperature of the
board and components to prevent
thermal shock and begin evaporat-
ing solvents from the solder paste.
The reflow zone briefly elevates
the temperature sufficiently to
produce a reflow of the solder.
The rates of change of tempera-
ture for the ramp-up and cool-
down zones are chosen to be low
enough to not cause deformation
of the board or damage to compo-
nents due to thermal shock. The
maximum temperature in the
reflow zone (T
MAX
) should not
exceed 235
°
C.
These parameters are typical for a
surface mount assembly process
for HP SOT-323 diodes. As a
general guideline, the circuit
board and components should be
exposed only to the minimum
temperatures and times necessary
to achieve a uniform reflow of
solder.
TIME (seconds)
T
MAX
T
°
C
0
0
50
100
150
200
250
60
Preheat
Zone
Cool Down
Zone
Reflow
Zone
120
180
240
300
Figure 12. Surface Mount Assembly Profile.
相關PDF資料 |
PDF描述 |
|---|---|
| HSMS-282B | Surface Mount RF Schottky Barrier Diodes(表貼型射頻肖特基勢壘二極管) |
| HSMS-282C | Surface Mount RF Schottky Barrier Diodes(表貼型射頻肖特基勢壘二極管) |
| HSMS-282E | Surface Mount RF Schottky Barrier Diodes(表貼型射頻肖特基勢壘二極管) |
| HSMS-282F | Surface Mount RF Schottky Barrier Diodes(表貼型射頻肖特基勢壘二極管) |
| HSMS-282K | Surface Mount RF Schottky Barrier Diodes(表貼型射頻肖特基勢壘二極管) |
相關代理商/技術參數 |
參數描述 |
|---|---|
| HSMS-280A/1A/2A | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Surface Mount Schottky Diodes -- Reliability Data (28K in pdf) |
| HSMS-280ASERIES | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Surface Mount RF Schottky Diodes in SOT-323 (SC-70) (87K in pdf) |
| HSMS-280B | 制造商:AGILENT 制造商全稱:AGILENT 功能描述:Surface Mount RF Schottky Barrier Diodes |
| HSMS-280B-BLKG | 功能描述:肖特基二極管與整流器 70 VBR 2 pF RoHS:否 制造商:Skyworks Solutions, Inc. 產品:Schottky Diodes 峰值反向電壓:2 V 正向連續(xù)電流:50 mA 最大浪涌電流: 配置:Crossover Quad 恢復時間: 正向電壓下降:370 mV 最大反向漏泄電流: 最大功率耗散:75 mW 工作溫度范圍:- 65 C to + 150 C 安裝風格:SMD/SMT 封裝 / 箱體:SOT-143 封裝:Reel |
| HSMS-280B-TR1G | 功能描述:肖特基二極管與整流器 70 VBR 2 pF RoHS:否 制造商:Skyworks Solutions, Inc. 產品:Schottky Diodes 峰值反向電壓:2 V 正向連續(xù)電流:50 mA 最大浪涌電流: 配置:Crossover Quad 恢復時間: 正向電壓下降:370 mV 最大反向漏泄電流: 最大功率耗散:75 mW 工作溫度范圍:- 65 C to + 150 C 安裝風格:SMD/SMT 封裝 / 箱體:SOT-143 封裝:Reel |
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