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參數(shù)資料
| 型號(hào)： | HSMx-C110 |
| 英文描述： | Surface Mount Chip LEDs(表貼型芯片LED) |
| 中文描述： | 表面貼裝芯片發(fā)光二極管（表貼型芯片發(fā)光二極管） |
| 文件頁(yè)數(shù)： | 6/8頁(yè) |
| 文件大?。?/td> | 222K |
| 代理商： | HSMX-C110 |
6
Figure 6. Relative Intensity vs. Angle for HSMx-C150,
C170 and C190.
Note:
All dimensions in millimeters (inches).
Figure 7. Recommended Reflow Soldering
Profile.
Figure 8. Recommended Soldering Pattern
for HSMx-C150.
Figure 9. Recommended Soldering Pattern
for HSMx-C170.
Figure 10. Recommended Soldering Pattern
for HSMx-C190.
Figure 11. Recommended Soldering Pattern
for HSMx-C110.
R
1.00
0
-90
ANGLE
0.80
0.60
0.50
0.70
0.20
0.10
0.30
0.40
0.90
-70
-50
-30
0
20 30
50
70
90
-20
-80
-60
-40
-10
10
40
60
80
230°C MAX.
10 SEC. MAX.
4°C/SEC.
MAX.
OVER 2 MIN.
TIME
T
4°C/SEC. MAX.
140-160°C
3°C/SEC. MAX.
1.5 (0.059)
1.5
(0.059)
1.5
(0.059)
2.0
(0.079)
1.2 (0.047)
1.2
(0.047)
0.9
(0.035)
1.2
(0.047)
0.8 (0.031)
0.8
(0.031)
0.7
(0.028)
0.8
(0.031)
5.0 (0.200)
1.5 (0.059)
1.5
(0.059)
1.5
(0.059)
2.0
(0.079)
0.9 (0.035)
0.2 (0.008)
0.9 (0.035)
CENTERING BOARD
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| HSMx-C260 | Surface Mount Chip LEDs(表貼型芯片LED) |
| HSMx-C650 | Surface Mount Chip LEDs(表貼型芯片LED) |
| HSMF-C655 | Surface Mount Chip LEDs(表貼型芯片LED) |
| HSMx-C670 | Surface Mount Chip LEDs(表貼型芯片LED) |
| HSMx-C660 | Right Angle Surface Mount Chip LEDs(直角表面封裝LED) |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| HSMX-C120 | 制造商:AGILENT 制造商全稱:AGILENT 功能描述:Surface Mount Chip LEDs |
| HSMX-C150 | 制造商:HP 制造商全稱:Agilent(Hewlett-Packard) 功能描述:SMT ChipLEDs |
| HSMX-C170 | 制造商:HP 制造商全稱:Agilent(Hewlett-Packard) 功能描述:SMT ChipLEDs |
| HSMX-C177 | 制造商:AGILENT 制造商全稱:AGILENT 功能描述:Agilent HSMx-C1xx High Performance Chip LED |
| HSMX-C190 | 制造商:HP 制造商全稱:Agilent(Hewlett-Packard) 功能描述:SMT ChipLEDs |
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