參數(shù)資料
型號(hào): HYS64T32000HDL
廠商: INFINEON TECHNOLOGIES AG
英文描述: 200-Pin Small Outline Dual-In-Line Memory Module
中文描述: 200引腳小外型雙列內(nèi)存模組
文件頁(yè)數(shù): 65/67頁(yè)
文件大小: 1527K
代理商: HYS64T32000HDL
HYS[64T[3200/6400/12802]0/72T[6400/12802]0][G/H]U–[3.7/5]–A
512 Mbit DDR2 SDRAM
Product Type Nomenclature (DDR2 DRAMs and DIMMs)
Data Sheet
65
Rev. 0.87, 2004-06
09122003-GZEK-H4J6
8
Product Type Nomenclature (DDR2 DRAMs and DIMMs)
Infineon’s nomenclature uses simple coding combined with some propriatory coding.
Table 31
provides examples
for module and component product type number as well as the field number. The detailed field description together
with possible values and coding explanation is listed for modules in
Table 32
and for components in
Table 33
.
Table 31
Example for
Nomenclature Fields and Examples
Field Number
1
2
HYS
64
DDR2 DRAM
HYB
3
T
T
4
64
512
5
0
16
6
2
7
0
0
8
K
A
9
M
C
10
–5
–5
11
–A
Micro-DIMM
18
Table 32
Field
1
2
DDR2 DIMM Nomenclature
Description
INFINEON Modul Prefix
Module Data Width [bit]
Values
HYS
64
72
T
32
64
128
256
0 .. 9
0, 2, 4
0 .. 9
A .. Z
S
M
R
U
–3.7
–5
–A
–B
Coding
Constant
Non-ECC
ECC
DDR2
256 MByte
512 MByte
1 GByte
2 GByte
look up table
1, 2, 4
look up table
look up table
S
O-DIMM
M
icro-DIMM
R
egistered
U
nbuffered
PC2–4200 4–4–4
PC2–3200 3–3–3
First
Second
3
4
DRAM Technology
Memory Density per I/O [Mbit];
Module Density
1)
1) Multiplying “Memory Density per I/O” with “Module Data Width” and dividing by 8 for Non-ECC and 9 for ECC modules
gives the overall module memory density in MBytes as listed in column “Coding”.
5
6
7
8
9
Raw Card Generation
Number of Module Ranks
Product Variations
Package, Lead-Free Status
Module Type
10
Speed Grade
11
Die Revision
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