參數(shù)資料
型號(hào)： IBM25EMPPC603EFG-100
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 100 MHz, RISC PROCESSOR, PQFP240
封裝： 32 X 32 MM, 4.10 MM HEIGHT, 0.50 MM PITCH, FP-240
文件頁(yè)數(shù)： 30/42頁(yè)
文件大小： 509K
代理商： IBM25EMPPC603EFG-100
36
603e and EM603e Hardware Specification
1.8.6.1.1 Thermal Characteristics
The thermal characteristics for a C4FP package are as follows:
Thermal resistance (junction-to-heatsink) = Rθjs or θjs = 0.03°C/Watt (junction-to-heatsink)
1.8.6.1.2 Thermal Management Example
The following example is based on a typical embedded conguration using a C4FP package. The heatsink
used for this data is a pinn heatsink #2338 attached to the C4FP package with 2-stage epoxy.
The junction temperature can be calculated from the junction-to-ambient thermal resistance, as follows:
Junction temperature:
Tj = Ta + Rθja * P
or
Tj = Ta + (Rθjs + Rsa) * P
Where:
Ta is the ambient temperature in the vicinity of the device
Rθja is the junction-to-ambient thermal resistance
Rθjs is the junction-to-heatsink thermal resistance (includes thermal grease or thermal adhesive)
Rsa is the heatsink-to-ambient thermal resistance
P is the power dissipated by the device
Note: Rθjs includes the resistance of a typical layer of thermal compound. If a lower conductivity material
is used, its thermal resistance must be included.
In this environment, it can be assumed that all the heat is dissipated to the ambient through the heatsink, so
the junction-to-ambient thermal resistance is the sum of the resistances from the junction to the heatsink and
from the heatsink to the ambient.
Note that verication of external thermal resistance and case temperature should be performed for each
application. Thermal resistance can vary considerably due to many factors including degree of air
turbulence.
Figure 16 provides a thermal management example for the C4FP package.
Figure 16. C4FP Thermal Management Example
Forced Convection (m/sec)
0
5
10
15
20
25
30
35
40
0
0.25
0.5
1
2
Exposed Die
Aluminum
Plate
Pinfin
Junction-to-Ambient
Thermal
Resistance
(
C/W)
IBM C4FP
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