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參數資料
| 型號： | IBM25EMPPC750EBUB2330 |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 233 MHz, RISC PROCESSOR, CBGA360 |
| 封裝： | 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360 |
| 文件頁數： | 31/43頁 |
| 文件大?。?/td> | 431K |
| 代理商： | IBM25EMPPC750EBUB2330 |
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Preliminary and subject to change without notice
PPC740 and PPC750 Hardware Specifications
37 of 43
Ultimately, the nal selection of an appropriate heat sink for the PPC740 and PPC750
depends on many factors, such as thermal performance at a given air velocity, spatial
volume, mass, attachment method, assembly, and cost.
7.7.1 Internal Package Conduction Resistance
For the exposed-die packaging technology, shown in Table 3 , the intrinsic conduction
thermal resistance paths are as follows:
The die junction-to-case thermal resistance
The die junction-to-lead thermal resistance
Figure 20 depicts the primary heat transfer path for a package with an attached heat
sink mounted to a printed-circuit board.
Figure 20. C4 Package with Heat Sink Mounted to a Printed-Circuit Board
Heat generated on the active side (ball) of the chip is conducted through the silicon,
then through the heat sink attach material (or thermal interface material), and nally
to the heat sink where it is removed by forced-air convection. Since the silicon thermal
resistance is quite small, for a rst-order analysis, the temperature drop in the silicon
may be neglected. Thus, the heat sink attach material and the heat sink conduction/
convective thermal resistances are the dominant terms.
7.7.2 Adhesives and Thermal Interface Materials
A thermal interface material is recommended at the package lid-to-heat sink interface
to minimize the thermal contact resistance. For those applications where the heat sink
is attached by a spring clip mechanism, Figure 21 shows the thermal performance of
three thin-sheet thermal-interface materials (silicon, graphite/oil, oroether oil), a bare
joint, and a joint with thermal grease as a function of contact pressure. As shown, the
performance of these thermal interface materials improves with increasing contact
pressure. The use of thermal grease signicantly reduces the interface thermal resis-
tance. That is, the bare joint results in a thermal resistance approximately 7 times
External Resistance
Internal Resistance
(Note the internal versus external package
Radiation
Convection
Radiation
Convection
Heat Sink
Die/Package
Printed-Circuit Board
Thermal Interface Material
Package/Leads
Chip Junction
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