參數(shù)資料
型號(hào)： ICM7555CD
廠商： NXP Semiconductors N.V.
元件分類(lèi)： 時(shí)鐘及定時(shí)
英文描述： General purpose CMOS timer
封裝： ICM7555CD/01<SOT96-1 (SO8)|<<http://www.nxp.com/packages/SOT96-1.html<1<week 12, 2005,;ICM7555CD/01<SOT96-1 (SO8)|<<http://www.nxp.com/packages/SOT96-1.html<1<week
文件頁(yè)數(shù)： 17/22頁(yè)
文件大小： 122K
代理商： ICM7555CD
ICM7555_2
NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 — 3 August 2009
17 of 22
NXP Semiconductors
ICM7555
General purpose CMOS timer
13.4 Reflow soldering
Key characteristics in reflow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
Figure 19
) than a SnPb process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 6
and
7
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Figure 19
.
Table 6.
Package thickness (mm)
SnPb eutectic process (from J-STD-020C)
Package reflow temperature (
°
C)
Volume (mm
3
)
< 350
235
220
≥
350
220
220
< 2.5
≥
2.5
Table 7.
Package thickness (mm)
Lead-free process (from J-STD-020C)
Package reflow temperature (
°
C)
Volume (mm
3
)
< 350
260
260
250
350 to 2000
260
250
245
> 2000
260
245
245
< 1.6
1.6 to 2.5
> 2.5
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ICM7555CD,602 功能描述:計(jì)時(shí)器和支持產(chǎn)品 CMOS TIMER RoHS:否 制造商:Micrel 類(lèi)型:Standard 封裝 / 箱體:SOT-23 內(nèi)部定時(shí)器數(shù)量:1 電源電壓-最大:18 V 電源電壓-最小:2.7 V 最大功率耗散: 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝:Reel
ICM7555CD,623 功能描述:計(jì)時(shí)器和支持產(chǎn)品 CMOS TIMER RoHS:否 制造商:Micrel 類(lèi)型:Standard 封裝 / 箱體:SOT-23 內(nèi)部定時(shí)器數(shù)量:1 電源電壓-最大:18 V 電源電壓-最小:2.7 V 最大功率耗散: 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝:Reel
ICM7555CD/01 功能描述:計(jì)時(shí)器和支持產(chǎn)品 CMOS TIMER 0 TO +70 RoHS:否 制造商:Micrel 類(lèi)型:Standard 封裝 / 箱體:SOT-23 內(nèi)部定時(shí)器數(shù)量:1 電源電壓-最大:18 V 電源電壓-最小:2.7 V 最大功率耗散: 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝:Reel
ICM7555CD/01,112 功能描述:計(jì)時(shí)器和支持產(chǎn)品 CMOS TIMER 0 TO +70 RoHS:否 制造商:Micrel 類(lèi)型:Standard 封裝 / 箱體:SOT-23 內(nèi)部定時(shí)器數(shù)量:1 電源電壓-最大:18 V 電源電壓-最小:2.7 V 最大功率耗散: 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝:Reel
ICM7555CD/01,118 功能描述:計(jì)時(shí)器和支持產(chǎn)品 CMOS TIMER GEN-PURPOSE RoHS:否 制造商:Micrel 類(lèi)型:Standard 封裝 / 箱體:SOT-23 內(nèi)部定時(shí)器數(shù)量:1 電源電壓-最大:18 V 電源電壓-最小:2.7 V 最大功率耗散: 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝:Reel
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