參數(shù)資料
型號: ICS843002CY-31T
廠商: SPECTRUM CONTROL INC
元件分類: 時鐘產(chǎn)生/分配
英文描述: 700 MHz, OTHER CLOCK GENERATOR, PQFP64
封裝: 10 X 10 MM, 1 MM HEIGHT, EXPOSED PAD, MS-026BCD, TQFP-64
文件頁數(shù): 16/27頁
文件大小: 270K
代理商: ICS843002CY-31T
843002CY-31
www.icst.com/products/hiperclocks.html
REV. B NOVEMBER 22, 2005
23
Integrated
Circuit
Systems, Inc.
ICS843002-31
700MHZ FEMTOCLOCKSVCXO BASED
FREQUENCY TRANSLATOR AND JITTER ATTENUATOR
PRELIMINARY
POWER CONSIDERATIONS
This section provides information on power dissipation and junction temperature for the ICS843002-31.
Equations and example calculations are also provided.
1. Power Dissipation.
The total power dissipation for the ICS843002-31 is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for V
CC = 3.3V + 5% = 3.465V, which gives worst case results.
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
Power (core)
MAX = VCC_MAX * IEE_MAX = 3.465V * 395mA = 1368.67mW
Power (outputs)
MAX = 30mW/Loaded Output pair
If all outputs are loaded, the total power is 2 * 30mW = 60mW
Total Power
_MAX (3.465V, with all outputs switching) = 1368.67mW + 60mW = 1428.67mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the
device. The maximum recommended junction temperature for HiPerClockSTM devices is 125°C.
The equation for Tj is as follows: Tj =
θ
JA * Pd_total + TA
Tj = Junction Temperature
θ
JA = Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
T
A = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance
θ
JA must be used. Assuming a
moderate air flow of 200 linear feet per minute and a multi-layer board, the appropriate value is 17.2°C/W per Table 7 below.
Therefore, Tj for an ambient temperature of 70°C with all outputs switching is:
70°C + 1.429W * 17.2°C/W = 94.6°C. This is well below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow,
and the type of board (single layer or multi-layer).
θθθθθ
JA by Velocity (Linear Feet per Minute)
TABLE 7. THERMAL RESISTANCE
θθθθθ
JA
FOR
64-PINTQFP, FORCED CONVECTION
0
200
500
Multi-Layer PCB, JEDEC Standard Test Boards
22.3°C/W
17.2°C/W
15.1°C/W
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