1-TO-5 D
參數(shù)資料
型號(hào): ICS8634BY-01LF
廠商: IDT, Integrated Device Technology Inc
文件頁(yè)數(shù): 17/17頁(yè)
文件大?。?/td> 0K
描述: IC BUFFER ZD 1:5 LVPECL 32-LQFP
標(biāo)準(zhǔn)包裝: 250
系列: HiPerClockS™
類型: 扇出配送,多路復(fù)用器,零延遲緩沖器
PLL: 帶旁路
輸入: HCSL,LVDS,LVHSTL,LVPECL,SSTL
輸出: LVPECL
電路數(shù): 1
比率 - 輸入:輸出: 2:5
差分 - 輸入:輸出: 是/是
頻率 - 最大: 700MHz
除法器/乘法器: 是/無(wú)
電源電壓: 3.135 V ~ 3.465 V
工作溫度: 0°C ~ 70°C
安裝類型: 表面貼裝
封裝/外殼: 32-LQFP
供應(yīng)商設(shè)備封裝: 32-TQFP(7x7)
包裝: 托盤
產(chǎn)品目錄頁(yè)面: 1249 (CN2011-ZH PDF)
其它名稱: 800-1189
8634BY-01LF
8634BY-01
www.idt.com
REV. D OCTOBER 4, 2010
9
ICS8634-01
1-TO-5 DIFFERENTIAL-TO-3.3V LVPECL
ZERO DELAY BUFFER
The following component footprints are used in this layout
example:
All the resistors and capacitors are size 0603.
POWER AND GROUNDING
Place the decoupling capacitors C1, C2, C4, C5, C6, and C7, as
close as possible to the power pins. If space allows, placement
of the decoupling capacitor on the component side is preferred.
This can reduce unwanted inductance between the decoupling
capacitor and the power pin caused by the via.
Maximize the power and ground pad sizes and number of vias
capacitors. This can reduce the inductance between the power
and ground planes and the component power and ground pins.
The RC filter consisting of R7, C11, and C16 should be placed
as close to the V
CCA pin as possible.
CLOCK TRACES AND TERMINATION
Poor signal integrity can degrade the system performance or
cause system failure. In synchronous high-speed digital systems,
the clock signal is less tolerant to poor signal integrity than other
signals. Any ringing on the rising or falling edge or excessive ring
back can cause system failure. The shape of the trace and the
trace delay might be restricted by the available space on the board
and the component location. While routing the traces, the clock
signal traces should be routed first and should be locked prior to
routing other signal traces.
The differential 50
Ω output traces should have same
length.
Avoid sharp angles on the clock trace. Sharp angle
turns cause the characteristic impedance to change on
the transmission lines.
Keep the clock traces on the same layer. Whenever pos-
sible, avoid placing vias on the clock traces. Placement
of vias on the traces can affect the trace characteristic
impedance and hence degrade signal integrity.
To prevent cross talk, avoid routing other signal traces in
parallel with the clock traces. If running parallel traces is
unavoidable, allow a separation of at least three trace
widths between the differential clock trace and the other
signal trace.
Make sure no other signal traces are routed between the
clock trace pair.
The matching termination resistors should be located as
close to the receiver input pins as possible.
FIGURE 5B.
PCB BOARD LAYOUT FOR ICS8634-01
C4
C1
U1
VIA
VCCA
VCCO
C7
C11
C16
C5
VCC
C2
C6
GND
R7
50 Ohm
Traces
Pin 1
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