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參數(shù)資料
| 型號： | IDT7281L15PA8 |
| 廠商： | IDT, Integrated Device Technology Inc |
| 文件頁數(shù)： | 10/12頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC MEM FIFO 512X9 15NS 56-TSSOP |
| 標準包裝： | 2,000 |
| 系列： | 7200 |
| 功能： | 異步 |
| 存儲容量： | 4.6K（512 x 9） |
| 數(shù)據(jù)速率： | 40MHz |
| 訪問時間： | 15ns |
| 電源電壓： | 4.5 V ~ 5.5 V |
| 工作溫度： | 0°C ~ 70°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 56-TFSOP（0.240"，6.10mm 寬） |
| 供應商設備封裝： | 56-TSSOP |
| 包裝： | 帶卷 (TR) |
| 其它名稱： | 7281L15PA8 |
7
COMMERCIALTEMPERATURERANGE
IDT7280/7281/7282/7283/7284/7285 5V ASYNCHRONOUS FIFO
DUAL 256 x 9, 512 x 9, 1,024 x 9, 2,048 x 9, 4,096 x 9 and 8,192 x 9
JUNE 29, 2012
Figure 9. Half-Full Flag Timing
Figure 10. Expansion Out
Figure 11. Expansion In
OPERATING MODES:
Care must be taken to assure that the appropriate flag is monitored by
eachsystem(i.e.FFismonitoredonthedevicewhereWisused;EFismonitored
on the device where R is used).
SINGLE DEVICE MODE
A single IDT7280/7281/7282/7283/7284/7285 may be used when the
applicationrequirementsarefor256/512/1,024/2,048/4,096/8,192wordsor
less. TheseFIFOsareinaSingleDeviceConfigurationwhentheExpansion
In (XI) control input is grounded (see Figure 12).
DEPTH EXPANSION
These devices can easily be adapted to applications when the require-
ments are for greater than 256/512/1,024/2,048/4,096/8,192 words. Figure
14 demonstrates a four-FIFO Depth Expansion using two IDT7280/7281/
7282/7283/7284/7285s. Any depth can be attained by adding additional
IDT7280/7281/7282/7283/7284/7285s. These FIFOs operate in the Depth
Expansionmodewhenthefollowingconditionsaremet:
1. ThefirstFIFOmustbedesignatedbygroundingtheFirstLoad(FL)control
input.
2. All other FIFOs must have FLin the HIGH state.
3. TheExpansionOut(XO)pinofeachdevicemustbetiedtotheExpansion
In (XI) pin of the next device. See Figure 14.
4. ExternallogicisneededtogenerateacompositeFullFlag(FF)andEmpty
Flag (EF). This requires the ORing of all EFs and ORing of all FFs (i.e. all
must be set to generate the correct composite FFor EF). See Figure 14.
5. TheRetransmit(RT)functionandHalf-FullFlag(HF)arenotavailablein
the Depth Expansion Mode.
R
W
HF
tRHF
3208 drw 11
HALF-FULL OR LESS
MORE THAN HALF-FULL
HALF-FULL OR LESS
tWHF
R
W
XO
3208 drw 12
WRITE TO
LAST PHYSICAL
LOCATION
tXOL
tXOH
READ FROM
LAST PHYSICAL
LOCATION
tXOL
tXOH
W
XI
R
3208 drw 13
WRITE TO
FIRST PHYSICAL
LOCATION
READ FROM
FIRST PHYSICAL
LOCATION
tXIS
tXIR
tXI
tXIS
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| IDT7281L15PAGI | 制造商:Integrated Device Technology Inc 功能描述:IC MEM FIFO 512X9 15NS 56-TSSOP |
| IDT7281L15PAGI8 | 制造商:Integrated Device Technology Inc 功能描述:IC MEM FIFO 512X9 15NS 56-TSSOP |
| IDT7281L15PAI | 功能描述:IC MEM FIFO 512X9 15NS 56-TSSOP RoHS:否 類別:集成電路 (IC) >> 邏輯 - FIFO 系列:7200 標準包裝:80 系列:7200 功能:同步 存儲容量:18.4K（1K x 18） 數(shù)據(jù)速率:- 訪問時間:10ns 電源電壓:4.5 V ~ 5.5 V 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:64-LQFP 供應商設備封裝:64-TQFP（10x10） 包裝:托盤 其它名稱:72225LB10TF |
| IDT7281L15PAI8 | 功能描述:IC MEM FIFO 512X9 15NS 56-TSSOP RoHS:否 類別:集成電路 (IC) >> 邏輯 - FIFO 系列:7200 標準包裝:80 系列:7200 功能:同步 存儲容量:18.4K（1K x 18） 數(shù)據(jù)速率:- 訪問時間:10ns 電源電壓:4.5 V ~ 5.5 V 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:64-LQFP 供應商設備封裝:64-TQFP（10x10） 包裝:托盤 其它名稱:72225LB10TF |
| IDT7281L20PA | 功能描述:IC MEM FIFO 512X9 20NS 56-TSSOP RoHS:否 類別:集成電路 (IC) >> 邏輯 - FIFO 系列:7200 標準包裝:80 系列:7200 功能:同步 存儲容量:18.4K（1K x 18） 數(shù)據(jù)速率:- 訪問時間:10ns 電源電壓:4.5 V ~ 5.5 V 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:64-LQFP 供應商設備封裝:64-TQFP（10x10） 包裝:托盤 其它名稱:72225LB10TF |
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