IDT72V205/72V215/72V225/72V235/72V245 3.3V CMOS SyncFIFOTM 256 x 18, 512 x 18, 1,024 x 18, 2,048 x 1" />
參數(shù)資料
型號(hào): IDT72V235L15PFI
廠商: IDT, Integrated Device Technology Inc
文件頁數(shù): 10/25頁
文件大?。?/td> 0K
描述: IC FIFO SYNC 2048X18 15NS 64TQFP
標(biāo)準(zhǔn)包裝: 90
系列: 72V
功能: 同步
存儲(chǔ)容量: 36.8K(2K x 18)
數(shù)據(jù)速率: 67MHz
訪問時(shí)間: 15ns
電源電壓: 3 V ~ 3.6 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 64-LQFP
供應(yīng)商設(shè)備封裝: 64-TQFP(14x14)
包裝: 托盤
其它名稱: 72V235L15PFI
18
IDT72V205/72V215/72V225/72V235/72V245 3.3V CMOS SyncFIFOTM
256 x 18, 512 x 18, 1,024 x 18, 2,048 x 18 and 4,096 x 18
COMMERCIALANDINDUSTRIAL
TEMPERATURERANGES
MARCH 2013
Figure
21.
Read
Timing
with
Synchronous
Programmable
Flags
(FWFT
Mode)
NOTES:
1.
tSKEW1
is
the
minimum
time
between
a
rising
RCLK
edge
and
a
rising
WCLK
edge
to
guarantee
that
IR
will
go
LOW
after
one
WCLK
plus
tWFF
.If
the
time
between
the
rising
edge
of
RLCK
and
the
rising
edge
of
WCLK
is
less
than
tSKEW1
,then
the
IR
assertion
may
be
delayed
an
extra
WCLK
cycle.
2.
tSKEW2
is
the
minimum
time
between
a
rising
RCLK
edge
and
a
rising
WCLK
edge
for
PAF
to
go
HIGH
during
the
current
clock
cycle.
If
the
time
between
the
rising
edge
of
RCLK
and
the
rising
edge
of
WCLK
is
less
th
an
t
SKEW2
,
then
the
PAF
deassertion
time
may
be
delayed
an
extra
WCLK
cycle.
3.
LD
=
HIGH
4.
n=
PAE
offset,
m
=
PAF
offset,
D
=
maximum
FIFO
depth
=
257
words
for
the
IDT72V205,
513
words
for
the
IDT72V215,
1,025
words
for
the
IDT72V225,
2,04
9words
for
IDT72V235
and
4,097
words
for
IDT72V245.
5.
Select
this
mode
by
setting
(
FL
,
RXI
,
WXI
)=
(1,0,1)
during
Reset.
WCLK
12
WEN
D
0
-
D
17
RCLK
tENS
REN
Q
0
-Q
17
PAF
HF
PAE
IR
OR
W
1
W
1
W
2
W
3
W
m+2
W
[m+3]
tOHZ
tSKEW1
tENH
tDS
tDH
tOE
tA
tPAFS
tWFF
tENS
OE
tSKEW2
W
D
4294
drw
21
tPAES
W
[D-n]
W
[D-n-1]
tA
tHF
tREF
W
[D-1]
W
D
tA
W
[D-n+1]
W
[m+4]
W
[D-n+2]
(1)
(2)
1
tENS
D-1
]
[
W
D-1
]
[
W
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