參數(shù)資料
型號(hào): IDT72V85L15PAG
廠商: INTEGRATED DEVICE TECHNOLOGY INC
元件分類: DRAM
英文描述: 3.3 Volt CMOS DUAL ASYNCHRONOUS FIFO
中文描述: 8K X 9 BI-DIRECTIONAL FIFO, 15 ns, PDSO56
封裝: GREEN, TSSOP-56
文件頁數(shù): 7/12頁
文件大小: 151K
代理商: IDT72V85L15PAG
7
COMMERCIAL TEMPERATURE RANGE
IDT72V81/72V82/72V83/72V84/72V85 3.3V CMOS DUAL ASYNCHRONOUS FIFO
512 x 9, 1024 x 9, 2048 x 9, 4096 x 9, 8192 x 9
JULY 17, 2006
Figure 9. Half-Full Flag Timing
Figure 10. Expansion Out
Figure 11. Expansion In
OPERATING MODES:
Care must be taken to assure that the appropriate flag is monitored by each
system(i.e.
FF
is monitored on the device where
W
is used;
EF
is monitored on
the device where
R
is used).
Single Device Mode
A single IDT72V81/72V82/72V83/72V84/72V85 may be used when the
application requirements are for 512/1,024/2,048/4,096/8,192 words or less.
These FIFOs are in a Single Device Configuration when the Expansion In (
XI
)
control input is grounded (see Figure 12).
Depth Expansion
These devices can easily be adapted to applications when the requirements
are for greater than
512/1,024/2,048/4,096/8,192
words. Figure 14 demon-
strates a four-FIFO Depth Expansion using two IDT72V81/72V82/72V83/
72V84/72V85s. Any depth can be attained by adding additional IDT72V81/
72V82/72V83/72V84/72V85s. These FIFOs operate in the Depth Expansion
mode when the following conditions are met:
1. The first FIFO must be designated by grounding the First Load (
FL
) control
input.
2. All other FIFOs must have
FL
in the high state.
3. The Expansion Out (
XO
) pin of each device must be tied to the Expansion
In (
XI
) pin of the next device. See Figure 14.
4. External logic is needed to generate a composite Full Flag (
FF
) and Empty
Flag (
EF
). This requires the ORing of all
EF
s and ORing of all
FF
s (i.e. all
must be set to generate the correct composite
FF
or
EF
). See Figure 14.
5. The Retransmt (
RT
) function and Half-Full Flag (
HF
) are not available in
the Depth Expansion Mode.
W
XI
R
WRITE TO
FIRST PHYSICAL
LOCATION
READ FROM
FIRST PHYSICAL
LOCATION
t
XIS
t
XIR
t
XI
t
XIS
3966 drw 13
R
W
XO
3966 drw 12
WRITE TO
LAST PHYSICAL
LOCATION
t
XOL
t
XOH
READ FROM
LAST PHYSICAL
LOCATION
t
XOL
t
XOH
R
W
HF
t
RHF
3966 drw 11
HALF-FULL OR LESS
MORE THAN HALF-FULL
HALF-FULL OR LESS
t
WHF
相關(guān)PDF資料
PDF描述
IDT72V85L15PAGI 3.3 Volt CMOS DUAL ASYNCHRONOUS FIFO
IDT72V85L20PAG 3.3 Volt CMOS DUAL ASYNCHRONOUS FIFO
IDT72V85L20PAGI 3.3 Volt CMOS DUAL ASYNCHRONOUS FIFO
IDT73720APQF 16-BIT TRI-PORT BUS EXCHANGER
IDT74FCT16952ETPV 16-BIT TRI-PORT BUS EXCHANGER
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
IDT72V85L15PAG8 功能描述:IC FIFO ASYNCH 4096X18 56TSSOP RoHS:是 類別:集成電路 (IC) >> 邏輯 - FIFO 系列:72V 標(biāo)準(zhǔn)包裝:90 系列:7200 功能:同步 存儲(chǔ)容量:288K(16K x 18) 數(shù)據(jù)速率:100MHz 訪問時(shí)間:10ns 電源電壓:4.5 V ~ 5.5 V 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:64-LQFP 供應(yīng)商設(shè)備封裝:64-TQFP(14x14) 包裝:托盤 其它名稱:72271LA10PF
IDT72V85L20PA 功能描述:IC FIFO ASYNC DUAL 20NS 56-TSSOP RoHS:否 類別:集成電路 (IC) >> 邏輯 - FIFO 系列:72V 標(biāo)準(zhǔn)包裝:90 系列:74ABT 功能:同步,雙端口 存儲(chǔ)容量:4.6K(64 x 36 x2) 數(shù)據(jù)速率:67MHz 訪問時(shí)間:- 電源電壓:4.5 V ~ 5.5 V 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:120-LQFP 裸露焊盤 供應(yīng)商設(shè)備封裝:120-HLQFP(14x14) 包裝:托盤 產(chǎn)品目錄頁面:1005 (CN2011-ZH PDF) 其它名稱:296-3984
IDT72V85L20PA8 功能描述:IC FIFO ASYNCH 4096X18 56TSSOP RoHS:否 類別:集成電路 (IC) >> 邏輯 - FIFO 系列:72V 標(biāo)準(zhǔn)包裝:90 系列:7200 功能:同步 存儲(chǔ)容量:288K(16K x 18) 數(shù)據(jù)速率:100MHz 訪問時(shí)間:10ns 電源電壓:4.5 V ~ 5.5 V 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:64-LQFP 供應(yīng)商設(shè)備封裝:64-TQFP(14x14) 包裝:托盤 其它名稱:72271LA10PF
IDT72V8980J 功能描述:IC DGTL SW 256X256 44-PLCC RoHS:否 類別:集成電路 (IC) >> 邏輯 - 信號(hào)開關(guān),多路復(fù)用器,解碼器 系列:72V 標(biāo)準(zhǔn)包裝:48 系列:74VHC 類型:多路復(fù)用器 電路:4 x 2:1 獨(dú)立電路:1 輸出電流高,低:8mA,8mA 電壓電源:單電源 電源電壓:2 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:16-SOIC(0.154",3.90mm 寬) 供應(yīng)商設(shè)備封裝:16-SOIC 包裝:管件
IDT72V8980J8 功能描述:IC DGTL SW 256X256 44-PLCC RoHS:否 類別:集成電路 (IC) >> 邏輯 - 信號(hào)開關(guān),多路復(fù)用器,解碼器 系列:72V 標(biāo)準(zhǔn)包裝:48 系列:74VHC 類型:多路復(fù)用器 電路:4 x 2:1 獨(dú)立電路:1 輸出電流高,低:8mA,8mA 電壓電源:單電源 電源電壓:2 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:16-SOIC(0.154",3.90mm 寬) 供應(yīng)商設(shè)備封裝:16-SOIC 包裝:管件