Intel386 CXSB EMBEDDED MICROPROCESSOR
8
3.0
DESIGN CONSIDERATIONS
This section describes the Intel386 CXSB micropro-
cessor instruction set, component and revision
identifier, and package thermal specifications.
3.1.
Instruction Set
The Intel386 CXSB microprocessor uses the same
instruction set as the Intel386 SX microprocessor
with the following exceptions.
The Intel386 CXSB microprocessor has one new
instruction (RSM). This Resume instruction causes
the processor to exit System Management Mode
(SMM). RSM requires 338 clocks for execution.
The Intel386 CXSB microprocessor requires more
clock cycles than the Intel386 SX microprocessor to
execute some instructions. Table 4 lists these
instructions and the Intel386 CXSB microprocessor
execution times. For the equivalent Intel386 SX
microprocessor execution times, refer to the
“Instruction Set Clock Count Summary” table in the
Intel386 SX Microprocessor data sheet (order
number 240187).
3.2.
Component and Revision
Identifier
To assist users, the microprocessor holds a
component identifier and revision identifier in its DX
register after reset. The upper 8 bits of DX hold the
component identifier, 23H. (The lower nibble, 03H,
identifies the Intel386 architecture, while the upper
nibble, 02H, identifies the second member of the
Intel386 microprocessor family.)
The lower 8 bits of DX hold the revision level
identifier. The revision identifier will, in general,
chronologically track those component steppings
that are intended to have certain improvements or
distinction from previous steppings. The revision
identifier will track that of the Intel386 CPU
whenever possible. However, the revision identifier
value is not guaranteed to change with every
stepping revision or to follow a completely uniform
numerical sequence, depending on the type or
intent of the revision or the manufacturing materials
required to be changed. Intel has sole discretion
over these characteristics of the component. The
initial revision identifier for the Intel386 CXSB micro-
processor is 09H.
3.3.
Package Thermal Specifications
The Intel386 CXSB microprocessor is specified for
operation with case temperature (T
) within the
range of 0°C–100°C. The case temperature can be
measured in any environment to determine whether
the microprocessor is within the specified operating
range. The case temperature should be measured
at the center of the top surface opposite the pins.
An increase in the ambient temperature (T
) causes
a proportional increase in the case temperature (T
C
)
and the junction temperature (T
). A packaged
device produces thermal resistance between
junction and case temperatures (
θ
) and between
junction and ambient temperatures (
θ
). The
relationships between the temperature and thermal
resistance parameters are expressed by these
equations (P = power dissipated as heat = V
CC
×
I
CC
):
1.
T
J
= T
C
+ P
×
θ
JC
2.
T
A
= T
J
– P
×
θ
JA
3.
T
C
= T
A
+ P
×
[
θ
JA
–
θ
JC
]
A safe operating temperature can be calculated
from the above equations by using the maximum
safe T
(100°C), the maximum power drawn by the
chip in the specific design, and the
θ
A
and
θ
JC
values from Table 3. The
θ
A
value depends on the
airflow (measured at the top of the chip) provided by
the system ventilation.
Table 3. Thermal Resistances (0°C/W)
θ
JA
,
θ
JC
Pkg
θ
JC
θ
JA
versus Airflow (ft/min)
0
100
200
100 PQFP
5.1
46.0
44.8
41.2
100 SQFP
14.0
63.0
N/A
N/A