參數(shù)資料
型號(hào): IR3082
廠商: International Rectifier
英文描述: XPHASE AMD OPTERON/ATHLON 64 CONTROL IC
中文描述: XPHASE AMD皓龍/速龍64控制IC
文件頁數(shù): 32/33頁
文件大?。?/td> 444K
代理商: IR3082
IR3082
Page 32 of 32
12/17/04
STENCIL DESIGN
The stencil apertures for the lead lands should be approximately 80% of the area of the lead lands.
Reducing the amount of solder deposited will minimize the occurrence of lead shorts. Since for 0.5mm
pitch devices the leads are only 0.25mm wide, the stencil apertures should not be made narrower;
openings in stencils < 0.25mm wide are difficult to maintain repeatable solder release.
The stencil lead land apertures should therefore be shortened in length by 80% and centered on the lead
land.
The land pad aperture should be striped with 0.25mm wide openings and spaces to deposit
approximately 50% area of solder on the center pad. If too much solder is deposited on the center pad
the part will float and the lead lands will be open.
The maximum length and width of the land pad stencil aperture should be equal to the solder resist
opening minus an annular 0.2mm pull back to decrease the incidence of shorting the center land to the
lead lands when the part is pushed into the solder paste.
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