參數(shù)資料
型號(hào): IRF1407STRR
廠商: International Rectifier
英文描述: TRANSISTOR | MOSFET | N-CHANNEL | 75V V(BR)DSS | 100A I(D) | TO-263AB
中文描述: 晶體管| MOSFET的| N溝道| 75V的五(巴西)直| 100號(hào)A(?。﹟對(duì)263AB
文件頁(yè)數(shù): 1/11頁(yè)
文件大?。?/td> 159K
代理商: IRF1407STRR
Parameter
Max.
100
70
520
3.8
200
1.3
± 20
390
Units
I
D
@ T
C
= 25°C
I
D
@ T
C
= 100°C
I
DM
P
D
@T
A
= 25°C
P
D
@T
C
= 25°C
Continuous Drain Current, V
GS
@ 10V
Continuous Drain Current, V
GS
@ 10V
Pulsed Drain Current
Power Dissipation
Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Single Pulse Avalanche Energy
Avalanche Current
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 seconds
A
W
W
W/°C
V
mJ
A
mJ
V/ns
V
GS
E
AS
I
AR
E
AR
dv/dt
T
J
T
STG
See Fig.12a, 12b, 15, 16
4.6
-55 to + 175
300 (1.6mm from case )
°C
HEXFET
Power MOSFET
S
D
G
Absolute Maximum Ratings
V
DSS
= 75V
R
DS(on)
= 0.0078
I
D
= 100A
Description
Advanced HEXFET
Power MOSFETs from International
Rectifier utilize advanced processing techniques to achieve
extremely low on-resistance per silicon area. This benefit,
combined with the fast switching speed and ruggedized
device design that HEXFET power MOSFETs are well
known for, provides the designer with an extremely efficient
and reliable device for use in a wide variety of applications.
The D
2
Pak is a surface mount power package capable of
accommodating die sizes up to HEX-4. It provides the highest
power capability and the lowest possible on-resistance in any
existing surface mount package. The D
2
Pak is suitable for
high current applications because of its low internal connection
resistance and can dissipate up to 2.0W in a typical surface
mount application.
The through-hole version (IRF1407L) is available for low-
profile applications.
10/05/01
www.irf.com
1
G
Advanced Process Technology
Ultra Low On-Resistance
Dynamic dv/dt Rating
175
°
C Operating Temperature
Fast Switching
Repetitive Avalanche Allowed up to Tjmax
G
G
G
G
G
Benefits
PD -94335
Parameter
Typ.
–––
–––
Max.
0.75
40
Units
°
C/W
R
θ
JC
R
θ
JA
Junction-to-Case
Junction-to-Ambient(PCB Mounted,steady-state)**
Thermal Resistance
IRF1407S
IRF1407L
TO-262
IRF1407L
D
2
Pak
IRF1407S
**When mounted on 1" square PCB (FR-4 or G-10 Material). For recommended footprint and soldering techniques refer
to application note #AN-994.
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