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4-58
Absolute Maximum Ratings
T
C
= 25
o
C, Unless Otherwise Specified
IRFP9140
-100
-100
-19
-12
-76
±
20
150
1.2
960
-55 to 150
UNITS
V
V
A
A
A
V
W
W/
o
C
mJ
o
C
Drain to Source Voltage (Note 1). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
DS
Drain to Gate Voltage (R
GS
= 20k
) (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
DGR
Continuous Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
D
T
C
=100
o
C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .I
DM
Pulsed Drain (Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .I
DM
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
GS
Maximum Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . P
D
Linear Derating Factor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Single Pulse Avalanche Energy Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . E
as
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T
J
, T
STG
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .T
L
Package Body for 10s, See Techbrief 334 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T
pkg
300
260
o
C
o
C
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. T
J
= 25
o
C to 125
o
C.
Electrical Specifications
T
C
= 25
o
C, Unless Otherwise Specified
PARAMETER
SYMBOL
TEST CONDITIONS
MIN
TYP
MAX
UNITS
Drain to Source Breakdown Voltage
BV
DSS
V
GS(TH)
I
DSS
V
GS
= 0V, I
D
= -250
μ
A, (Figure 10)
V
DS
= V
GS
, I
D
= -250
μ
A
V
DS
= Rated BV
DSS
, V
GS
= 0V
V
DS
= 0.8 x Rated BV
DSS
, V
GS
= 0V, T
J
= 125
o
C
V
DS
> I
D(ON)
x
r
DS(ON) MAX
, V
GS
= -10V
V
GS
=
±
20V
V
GS
= -10V, I
D
= -10A, (Figures 8, 9)
V
DS
≤
-50V, I
D
= -10A, (Figure 12)
V
DD
= -50V, I
D
≈
-19A, R
G
= 9.1
,
R
L
= 2.5
,
V
GS
= -10V, (Figures 17, 18)
MOSFET Switching Times Are Essentially Indepen-
dent of Operating Temperature
-100
-
-
V
Gate Threshold Voltage
-2.0
-
-4.0
V
Zero Gate Voltage Drain Current
-
-
25
μ
A
μ
A
-
-
250
On-State Drain Current (Note 2)
I
D(ON)
-19
-
-
A
Gate to Source Leakage Current
I
GSS
r
DS(ON)
g
fs
t
d(ON)
t
r
t
d(OFF)
t
f
Q
g(TOT)
-
-
±
100
nA
Drain to Source On Resistance (Note 2)
-
0.14
0.20
Forward Transconductance (Note 2)
5.3
7.9
-
S
Turn-On Delay Time
-
16
20
ns
Rise Time
-
65
100
ns
Turn-Off Delay Time
-
47
70
ns
Fall Time
-
28
70
ns
Total Gate Charge
(Gate to Source + Gate to Drain)
V
GS
= -10V, I
D
= -19A, V
DS
= 0.8 x Rated BV
DSS,
I
G(REF)
= -1.5mA (Figures 14, 19, 20)
Gate Charge is Essentially Independent of Operating
Temperature
-
37
55
nC
Gate to Source Charge
Q
gs
Q
gd
C
ISS
C
OSS
C
RSS
L
D
-
8.7
-
nC
Gate to Drain “Miller” Charge
-
22
-
nC
Input Capacitance
V
GS
= 0V, V
DS
= -25V, f = 1.0MHz, (Figure 11)
-
1200
-
pF
Output Capacitance
-
570
-
pF
Reverse Transfer Capacitance
-
160
-
pF
Internal Drain Inductance
MeasuredBetweenContact
Screw on Header That Is
Closer to Source and Gate
Pins and Center of Die
Modified MOSFET
Symbol Showing the In-
ternal Device Induc-
tances
-
5.0
-
nH
Internal Source Inductance
L
S
Measured From the Source
Pin, 6mm (0.25in) From
Header and Source Bond-
ing Pad
-
13
-
nH
Junction to Case
R
θ
JC
R
θ
JA
-
-
0.83
o
C/W
Junction to Ambient
Free Air Operation
-
-
30
0
C/W
L
S
L
D
G
D
S
IRFP9140