參數(shù)資料
型號: IRFR2605
廠商: International Rectifier
英文描述: Power MOSFET(Vdss=55V, Rds(on)=0.075ohm, Id=19A)
中文描述: 功率MOSFET(減振鋼板基本\u003d 55V的,的Rds(on)\u003d 0.075ohm,身份證\u003d 19A條)
文件頁數(shù): 1/8頁
文件大?。?/td> 345K
代理商: IRFR2605
PD - 9.1253
HEXFET
Power MOSFET
Ultra Low On-Resistance
ESD Protected
Surface Mount (IRFR2605)
Straight Lead (IRFU2605)
150°C Operating Temperature
Repetitive Avalanche Rated
Fast Switching
IRFU2605
IRFR2605
V
DSS
= 55V
R
DS(on)
= 0.075
I
D
= 19A
Description
Fourth Generation HEXFETs from International Rectifier utilize advanced
processing techniques that achieve extremely low on-resistance per silicon area
and allow electrostatic discharge protection to be integrated in the gate structure.
These benefits, combined with the ruggedized device design that HEXFETs are
known for, provide the designer with extremely efficient and reliable device for use
in a wide variety of applications.
The D-PAK is designed for surface mounting using vapor phase, infrared, or wave
soldering techniques. The straight lead version (IRFU series) is for through-hole
mounting applications. Power dissipation levels up to 1.5 watts are possible in
typical surface mount applications.
Absolute Maximum Ratings
Parameter
Max.
19
12
76
50
3.1
0.40
0.025
±20
100
12
5.0
4.5
Units
I
D
@ T
C
= 25°C
I
D
@ T
C
= 100°C
I
DM
P
D
@T
C
= 25°C
P
D
@T
C
= 25°C
Continuous Drain Current, V
GS
@ 10V
Continuous Drain Current, V
GS
@ 10V
Pulsed Drain Current
Power Dissipation
Power Dissipation (PCB Mount)**
Linear Derating Factor
Linear Derating Factor (PCB Mount)**
Gate-to-Source Voltage
Single Pulse Avalanche Energy
Avalanche Current
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
Junction and Storage Temperature Range
Soldering Temperature, for 10 seconds
Human Body Model, 100pF, 1.5K
A
V
GS
E
AS
I
AR
E
AR
dv/dt
T
J,
T
STG
V
mJ
A
mJ
V/ns
-55 to + 150
300 (1.6mm from case)
2000
V
ESD
V
Thermal Resistance
Parameter
Min.
Typ.
Max.
2.5
40
62
Units
R
θ
JC
R
θ
JA
R
θ
JA
** When mounted on 1" square PCB (FR-4 or G-10 Material).
For recommended footprint and soldering techniques refer to application note #AN-994.
Junction-to-Case
Junction-to-Ambient (PCB Mount)**
Junction-to-Ambient
°C/W
W/°C
W
°C
G
D
S
D-PAK
TO-252AA
I-PAK
TO-251AA
Next Data Sheet
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