參數(shù)資料
型號(hào): IRL2310
廠商: International Rectifier
英文描述: HEXFET Power MOSFET(HEXFET 功率 MOS場(chǎng)效應(yīng)管)
中文描述: HEXFET功率MOSFET(馬鞍山的HEXFET功率場(chǎng)效應(yīng)管)
文件頁(yè)數(shù): 1/4頁(yè)
文件大?。?/td> 55K
代理商: IRL2310
IRL2310
HEXFET
Power MOSFET
PD - 9.1275
Revision 1
V
DSS
= 100V
R
DS(on)
= 0.040
I
D
= 40A
Advanced Process Technology
Ultra Low On-Resistance
Dynamic dv/dt Rating
Repetitive Avalanche Rated
Logic-Level Gate Drive
R
DS(on)
Specified at V
GS
= 4.5V & 10V
175°C Operating Temperature
Fourth Generation HEXFETs from International Rectifier utilize advanced
processing techniques to achieve the lowest possible on resistance per
silicon area. This benefit, combined with the fast switching speed and
ruggedized device design for which HEXFET Power MOSFETs are well
known, provides the designer with an extremely efficient device for use in a
wide variety of application.
The TO-220 package is universally preferred for all commercial-industrial
applications at power dissipation levels to approximately 50 watts. The low
thermal resistance and low package cost of the TO-220 contribute to its wide
acceptance throughout the industry.
Description
Thermal Resistance
Parameter
Min.
––––
––––
––––
Typ.
––––
0.50
––––
Max.
0.90
––––
62
Units
R
θ
JC
R
θ
CS
R
θ
JA
Junction-to-Case
Case-to-Sink, Flat, Greased Surface
Junction-to-Ambient
°C/W
Absolute Maximum Ratings
Parameter
Max.
40
29
160
170
1.1
±20
500
24
17
5.5
Units
I
D
@ T
C
= 25°C
I
D
@ T
C
= 100°C
I
DM
P
D
@T
C
= 25°C
Continuous Drain Current, V
GS
@ 5.0V
Continuous Drain Current, V
GS
@ 5.0V
Pulsed Drain Current
Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Single Pulse Avalanche Energy
Avalanche Current
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 seconds
Mounting torque, 6-32 or M3 screw.
A
W
W/°C
V
mJ
A
mJ
V/ns
V
GS
E
AS
I
AR
E
AR
dv/dt
T
J
T
STG
-55 to + 175
°C
300 (1.6mm from case)
10 lbfin (1.1Nm)
PRELIMINARY
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