• 參數(shù)資料
    型號: IRLI540N
    廠商: International Rectifier
    英文描述: HEXFET Power MOSFET(HEXFET 功率MOS場效應管)
    中文描述: HEXFET功率MOSFET(馬鞍山的HEXFET功率場效應管)
    文件頁數(shù): 1/8頁
    文件大小: 122K
    代理商: IRLI540N
    IRLI540N
    PRELIMINARY
    HEXFET
    Power MOSFET
    PD - 9.1497A
    S
    D
    G
    V
    DSS
    = 100V
    R
    DS(on)
    = 0.044
    I
    D
    = 23A
    l
    Logic-Level Gate Drive
    l
    Advanced Process Technology
    l
    Isolated Package
    l
    High Voltage Isolation = 2.5KVRMS
    l
    Sink to Lead Creepage Dist. = 4.8mm
    l
    Fully Avalanche Rated
    Description
    Fifth Generation HEXFETs from International Rectifier
    utilize advanced processing techniques to achieve
    extremely low on-resistance per silicon area. This
    benefit, combined with the fast switching speed and
    ruggedized device design that HEXFET Power
    MOSFETs are well known for, provides the designer
    with an extremely efficient and reliable device for use
    in a wide variety of applications.
    TO-220 FULLPAK
    3/16/98
    Parameter
    Typ.
    –––
    –––
    Max.
    2.8
    65
    Units
    R
    θ
    JC
    R
    θ
    JA
    Junction-to-Case
    Junction-to-Ambient
    Thermal Resistance
    Parameter
    Max.
    23
    16
    120
    54
    0.36
    ± 16
    310
    18
    5.4
    5.0
    Units
    I
    D
    @ T
    C
    = 25°C
    I
    D
    @ T
    C
    = 100°C
    I
    DM
    P
    D
    @T
    C
    = 25°C
    Continuous Drain Current, V
    GS
    @ 10V
    Continuous Drain Current, V
    GS
    @ 10V
    Pulsed Drain Current
    Power Dissipation
    Linear Derating Factor
    Gate-to-Source Voltage
    Single Pulse Avalanche Energy
    Avalanche Current
    Repetitive Avalanche Energy
    Peak Diode Recovery dv/dt
    Operating Junction and
    Storage Temperature Range
    Soldering Temperature, for 10 seconds
    Mounting torque, 6-32 or M3 screw
    A
    W
    W/°C
    V
    mJ
    A
    mJ
    V/ns
    V
    GS
    E
    AS
    I
    AR
    E
    AR
    dv/dt
    T
    J
    T
    STG
    -55 to + 175
    300 (1.6mm from case )
    10 lbfin (1.1Nm)
    °C
    Absolute Maximum Ratings
    °C/W
    The TO-220 Fullpak eliminates the need for additional
    insulating hardware in commercial-industrial
    applications. The moulding compound used provides
    a high isolation capability and a low thermal resistance
    between the tab and external heatsink. This isolation
    is equivalent to using a 100 micron mica barrier with
    standard TO-220 product. The Fullpak is mounted to
    a heatsink using a single clip or by a single screw
    fixing.
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