21 FN7904.1 July 19, 2012 Ultra Thin Quad Flat No-Lead Plastic Package (UTQFN) 6 B E A D 0.10 C 2X C 0.05 C A 0.10 C A1 SEATING PLANE " />
參數(shù)資料
型號: ISL23428TFVZ-T7A
廠商: Intersil
文件頁數(shù): 14/21頁
文件大小: 0K
描述: IC DGTL POT 2CH 100K 14TSSOP
標準包裝: 1
系列: XDCP™
接片: 128
電阻(歐姆): 100k
電路數(shù): 2
溫度系數(shù): 標準值 45 ppm/°C
存儲器類型: 易失
接口: 4 線 SPI(芯片選擇)
電源電壓: 1.2 V ~ 5.5 V,1.7 V ~ 5.5 V
工作溫度: -40°C ~ 125°C
安裝類型: 表面貼裝
封裝/外殼: 14-TSSOP(0.173",4.40mm 寬)
供應(yīng)商設(shè)備封裝: 14-TSSOP
包裝: 標準包裝
其它名稱: ISL23428TFVZ-T7ADKR
ISL23428
21
FN7904.1
July 19, 2012
Ultra Thin Quad Flat No-Lead Plastic Package (UTQFN)
6
B
E
A
D
0.10 C
2X
C
0.05 C
A
0.10 C
A1
SEATING PLANE
INDEX AREA
2
1
N
TOP VIEW
BOTTOM VIEW
SIDE VIEW
NX (b)
SECTION "C-C"
e
CC
5
CL
TERMINAL TIP
(A1)
L
0.10 C
2X
e
L1
NX L
2
1
0.10 M C A B
0.05 M C
5
NX b
(DATUM B)
(DATUM A)
PIN #1 ID
16X
3.00
1.40
2.20
0.40
0.50
0.20
0.40
0.20
0.90
1.40
1.80
LAND PATTERN
10
K
L16.2.6x1.8A
16 LEAD ULTRA THIN QUAD FLAT NO-LEAD PLASTIC PACKAGE
SYMBOL
MILLIMETERS
NOTES
MIN
NOMINAL
MAX
A
0.45
0.50
0.55
-
A1
-
0.05
-
A3
0.127 REF
-
b
0.15
0.20
0.25
5
D
2.55
2.60
2.65
-
E
1.75
1.80
1.85
-
e
0.40 BSC
-
K0.15
-
L
0.35
0.40
0.45
-
L1
0.45
0.50
0.55
-
N16
2
Nd
4
3
Ne
4
3
θ
0-
12
4
Rev. 5 2/09
NOTES:
1. Dimensioning and tolerancing conform to ASME Y14.5-1994.
2. N is the number of terminals.
3. Nd and Ne refer to the number of terminals on D and E side,
respectively.
4. All dimensions are in millimeters. Angles are in degrees.
5. Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
7. Maximum package warpage is 0.05mm.
8. Maximum allowable burrs is 0.076mm in all directions.
9. JEDEC Reference MO-255.
10. For additional information, to assist with the PCB Land Pattern
Design effort, see Intersil Technical Brief TB389.
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