22 FN7549.2 February 26, 2014 Package Outline Drawing M16.173 16 LEAD THIN" />
參數資料
型號: ISL26310FBZ-T7A
廠商: Intersil
文件頁數: 15/23頁
文件大小: 0K
描述: IC ADC 12BIT SPI/SRL 125K 8SOIC
標準包裝: 250
位數: 12
采樣率(每秒): 125k
數據接口: 串行,SPI?
轉換器數目: 1
功率耗散(最大): 80mW
電壓電源: 單電源
工作溫度: -40°C ~ 125°C
安裝類型: 表面貼裝
封裝/外殼: 8-SOIC(0.154",3.90mm 寬)
供應商設備封裝: 8-SOIC
包裝: 帶卷 (TR)
輸入數目和類型: 1 個差分,單極
ISL26310, ISL26311, ISL26312, ISL26313, ISL26314, ISL26315, ISL26319
22
FN7549.2
February 26, 2014
Package Outline Drawing
M16.173
16 LEAD THIN SHRINK SMALL OUTLINE PACKAGE (TSSOP)
Rev 2, 5/10
0.09-0.20
SEE DETAIL "X"
DETAIL "X"
TYPICAL RECOMMENDED LAND PATTERN
TOP VIEW
SIDE VIEW
END VIEW
Dimension does not include mold flash, protrusions or gate burrs.
Mold flash, protrusions or gate burrs shall not exceed 0.15 per side.
Dimension does not include interlead flash or protrusion. Interlead
flash or protrusion shall not exceed 0.25 per side.
Dimensions are measured at datum plane H.
Dimensioning and tolerancing per ASME Y14.5M-1994.
Dimension does not include dambar protrusion. Allowable protrusion
shall be 0.08mm total in excess of dimension at maximum material
condition. Minimum space between protrusion and adjacent lead
is 0.07mm.
Dimension in ( ) are for reference only.
Conforms to JEDEC MO-153.
6.
3.
5.
4.
2.
1.
NOTES:
7.
(0.65 TYP)
(5.65)
(0.35 TYP)
0.90 +0.15/-0.10
0.60 ±0.15
0.15 MAX
0.05 MIN
PLANE
GAUGE
0°-8°
0.25
1.00 REF
(1.45)
16
2
1
3
8
B
1
3
9
A
PIN #1
I.D. MARK
5.00 ±0.10
6.40
4.40 ±0.10
0.65
1.20 MAX
SEATING
PLANE
0.25 +0.05/-0.06 5
C
H
0.20 C B A
0.10 C
-
0.05
0.10
C B A
M
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