ISL28233, ISL28433
20
Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems as noted
in the quality certifications found at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time
without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be
accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third
parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
FN7692.3
July 26, 2011
Products
Intersil Corporation is a leader in the design and manufacture of high-performance analog semiconductors. The Company's products
address some of the industry's fastest growing markets, such as, flat panel displays, cell phones, handheld products, and notebooks.
Intersil's product families address power management and analog signal processing functions. Go to
www.intersil.com/products for a
complete list of Intersil product families.
*For a complete listing of Applications, Related Documentation and Related Parts, please see the respective device information page
Revision History
The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to web to make
sure you have the latest Rev.
DATE
REVISION
CHANGE
5/31/11
FN7692.3
Changed minimum operating supply voltage from +1.65V to +1.8V throughout entire datasheet.
3/24/11
Added to Ordering Information Table on
page 2 - ISL28233SOICEVAL1Z, ISL28433TSSOPEVAL1Z,
ISL28433SOICEVAL1Z
12/2/10
FN7692.2
Removed "Coming Soon" from ISL28233FRZ device (8 Ld DFN) in "Ordering Information" on
page 2.Corrected
component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for
details." To "
θJA is measured in free air with the component mounted on a high effective thermal conductivity
test board with "direct attach" features. See Tech Brief TB379." (since TDFN has thermal pad; TDFN package
option not released yet)
10/27/10
FN7692.1
Changed Part Marking for ISL28233FUZ from 8233Z to 233FZ in “Ordering Information” table on
page 2Added ISL28233 in DFN package to Ordering Information” table on
page 2.Changed note in MIN MAX columns of “Electrical Specifications” table from:
“Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified. Temperature
limits established by characterization and are not production tested.”
To:
"Compliance to datasheet limits is assured by one or more methods: production test, characterization and/or
design."
8/25/10
FN7692.0
Initial Release.