24 FN7692.3 July 26, 2011 Thin Shrink Small Outline Package Family (TSSOP) N (N/2)+1 (N/2) TOP VIEW A D 0.20 C 2X B A N/2 LE" />
參數(shù)資料
型號: ISL28433FVZ-T13
廠商: Intersil
文件頁數(shù): 17/25頁
文件大?。?/td> 0K
描述: IC OPAMP CHOPPR RR .4MHZ 14TSSOP
標準包裝: 2,500
放大器類型: 斷路器(零漂移)
電路數(shù): 4
輸出類型: 滿擺幅
轉換速率: 0.2 V/µs
增益帶寬積: 400kHz
電流 - 輸入偏壓: 180pA
電壓 - 輸入偏移: 2µV
電流 - 電源: 18µA
電流 - 輸出 / 通道: 19mA
電壓 - 電源,單路/雙路(±): 1.8 V ~ 6 V,±0.825 V ~ 3 V
工作溫度: -40°C ~ 125°C
安裝類型: 表面貼裝
封裝/外殼: 14-TSSOP(0.173",4.40mm 寬)
供應商設備封裝: 14-TSSOP
包裝: 帶卷 (TR)
ISL28233, ISL28433
24
FN7692.3
July 26, 2011
Thin Shrink Small Outline Package Family (TSSOP)
N
(N/2)+1
(N/2)
TOP VIEW
A
D
0.20 C
2X
B A
N/2 LEAD TIPS
B
E1
E
0.25
CAB
M
1
H
PIN #1 I.D.
0.05
e
C
0.10 C
N LEADS
SIDE VIEW
0.10
CAB
M
b
c
SEE DETAIL “X”
END VIEW
DETAIL X
A2
0° - 8°
GAUGE
PLANE
0.25
L
A1
A
L1
SEATING
PLANE
MDP0044
THIN SHRINK SMALL OUTLINE PACKAGE FAMILY
SYMBOL
MILLIMETERS
TOLERANCE
14 LD 16 LD 20 LD 24 LD 28 LD
A
1.20
Max
A1
0.10
±0.05
A2
0.90
±0.05
b
0.25
+0.05/-0.06
c
0.15
+0.05/-0.06
D
5.00
6.50
7.80
9.70
±0.10
E
6.40
Basic
E1
4.40
±0.10
e
0.65
Basic
L
0.60
±0.15
L1
1.00
Reference
Rev. F 2/07
NOTES:
1. Dimension “D” does not include mold flash, protrusions or gate
burrs. Mold flash, protrusions or gate burrs shall not exceed
0.15mm per side.
2. Dimension “E1” does not include interlead flash or protrusions.
Interlead flash and protrusions shall not exceed 0.25mm per
side.
3. Dimensions “D” and “E1” are measured at dAtum Plane H.
4. Dimensioning and tolerancing per ASME Y14.5M
-1994.
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