參數(shù)資料
型號(hào): ISL29002
廠商: Intersil Corporation
英文描述: Light-to-Digital I2C Sensor(光電I2C傳感器)
中文描述: 光到數(shù)字的I2C傳感器(光電傳感器的I2C)
文件頁(yè)數(shù): 9/10頁(yè)
文件大小: 196K
代理商: ISL29002
9
FN7465.2
December 1, 2006
Typical Circuit
A typical application circuit is shown in Figure 12.
Suggested PCB Footprint
See Figure 13. Footprint pads should be a nominal 1-to-1
correspondence with package pads. The large, exposed
central die-mounting paddle in the center of the package
requires neither thermal nor electrical connection to the
PCB, and such connection should be avoided.
Layout Considerations
The ISL29002 is relatively insensitive to layout. Like other
I
2
C devices, it is intended to provide excellent performance
even in significantly noisy environments. There are only a
few considerations that will ensure best performance.
Route the supply and I
2
C traces as far as possible from all
sources of noise. Use two power-supply decoupling
capacitors, 4.7μF and 0.1μF, placed close to the device.
Soldering Considerations
Convection heating is recommended for reflow soldering;
direct-infrared heating is not recommended. The ISL29002’s
plastic ODFN package does not require a custom reflow
soldering profile, and is qualified to +260°C. A standard
reflow soldering profile with a +260°C maximum is
recommended.
Special Handling
ODFN8 is rated as JEDEC moisture level 4. Standard
JEDEC Level 4 procedure should be followed: 72hr floor life
at less than +30°C 60% RH. When baking the device, the
temperature required is +110°C or less due to special
molding compound.
ISL29002
VDD
VSS
REXT
A0
A1
A2
SDA
SCL
+
4.7μ
F
0.1μF
100k
MICROCONTROLLER
SDA
SCL
2.5-
3.3V
FIGURE 12. TYPICAL CIRCUIT
FIGURE 13. SUGGESTED PCB FOOTPRINT
(6x0.65)
(2.80 TYP)
(1.40)
(2.29)
(8x0.60)
(8x0.30)
ISL29002
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