18 FN7560.5 December 19, 2013 Package Outline Drawing M8.15 8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE Rev 4" />
參數(shù)資料
型號(hào): ISL33003IRTZ-T
廠商: Intersil
文件頁數(shù): 10/18頁
文件大?。?/td> 0K
描述: IC BUS BUFF HOTSWAP 2WR 8TDFN
標(biāo)準(zhǔn)包裝: 6,000
類型: 緩沖器
Tx/Rx類型: I²C Logic
電容 - 輸入: 10pF
電源電壓: 2.3 V ~ 5.5 V
電流 - 電源: 4mA
安裝類型: 表面貼裝
封裝/外殼: 8-WDFN 裸露焊盤
供應(yīng)商設(shè)備封裝: 8-TDFN(3x3)
包裝: 帶卷 (TR)
配用: ISL33003MSOPEVAL1Z-ND - EVAL BOARD ISL33003 8MSOP
ISL33001, ISL33002, ISL33003
18
FN7560.5
December 19, 2013
Package Outline Drawing
M8.15
8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE
Rev 4, 1/12
DETAIL "A"
TOP VIEW
INDEX
AREA
12
3
-C-
SEATING PLANE
x 45°
NOTES:
1. Dimensioning and tolerancing per ANSI Y14.5M-1994.
2. Package length does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
3. Package width does not include interlead flash or protrusions. Interlead
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
4. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
5. Terminal numbers are shown for reference only.
6. The lead width as measured 0.36mm (0.014 inch) or greater above the
seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch).
7. Controlling dimension: MILLIMETER. Converted inch dimensions are not
necessarily exact.
8. This outline conforms to JEDEC publication MS-012-AA ISSUE C.
SIDE VIEW “A
SIDE VIEW “B”
1.27 (0.050)
6.20 (0.244)
5.80 (0.228)
4.00 (0.157)
3.80 (0.150)
0.50 (0.20)
0.25 (0.01)
5.00 (0.197)
4.80 (0.189)
1.75 (0.069)
1.35 (0.053)
0.25(0.010)
0.10(0.004)
0.51(0.020)
0.33(0.013)
0.25 (0.010)
0.19 (0.008)
1.27 (0.050)
0.40 (0.016)
1.27 (0.050)
5.20(0.205)
1
2
3
4
5
6
7
8
TYPICAL RECOMMENDED LAND PATTERN
2.20 (0.087)
0.60 (0.023)
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