3
FN6212.1
June 30, 2006
Absolute Maximum Ratings
Thermal Information
V+ to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to 4.7V
Input Voltages
INH, Ax, Bx, ADDx (Note
2) . . . . . . . . . . . . . . -0.3 to (V+) + 0.3V
Output Voltages
COMx (Note
2) . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to (V+) + 0.3V
Continuous Current NO or COM . . . . . . . . . . . . . . . . . . . . .
±300mA
Peak Current NO or COM
(Pulsed 1ms, 10% Duty Cycle, Max) . . . . . . . . . . . . . . . .
±500mA
ESD Rating
HBM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . >4kV
Thermal Resistance (Typical, Note
3)θ
JA (°C/W)
16 Ld 3x3 TQFN Package . . . . . . . . . . . . . . . . . . . .
75
Maximum Junction Temperature (Plastic Package). . . . . . . . 150°C
Maximum Storage Temperature Range . . . . . . . . . . . . . -65°C to 150°C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300°C
(Lead Tips Only)
Operating Conditions
Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to 85°C
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
2. Signals on Ax, Bx, COMx, ADDx, or INH exceeding V+ or GND are clamped by internal diodes. Limit forward diode current to maximum current
ratings.
3.
θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See
Tech Brief TB379.
Electrical Specifications - 4.3V Supply Test Conditions: VSUPPLY = +3.9V to +4.5V, GND = 0V, VINH = 1.4V, VINL = 0.4V
(Notes
4,
8), Unless Otherwise Specified
PARAMETER
TEST CONDITIONS
TEMP
(°C)
MIN
TYP
MAX
UNITS
ANALOG SWITCH CHARACTERISTICS
Analog Signal Range, VANALOG
Full
0
-
V+
V
ON Resistance, RON
V+ = 3.9V, ICOM = 100mA, VAX or VBX = 0V to V+,
25
-
0.48
-
Full
-
0.56
-
RON Matching Between Channels,
RON
V+ = 3.9V, ICOM = 100mA, VAX or VBX = Voltage at
25
-
0.12
-
Full
-
0.13
-
RON Flatness, RFLAT(ON)
V+ = 3.9V, ICOM = 100mA, VAX or VBX = 0V t0 V+,
25
-
0.056
-
Full
-
0.06
-
Ax or Bx OFF Leakage Current,
IAx(OFF) or IBx(OFF)
V+ = 4.5V, VCOM = 0.3V, 3V, VAX or VBX = 3V, 0.3V
25
-50
1
50
nA
Full
-150
-
150
nA
COM ON Leakage Current,
ICOM(ON)
V+ = 4.5V, VCOM = VAX or VBX = 0.3V, 3V
25
-50
0.6
50
nA
Full
-150
-
150
nA
DIGITAL INPUT CHARACTERISTICS
Input Voltage High, VINH, VADDH
Full
1.5
1.07
-
V
Input Voltage Low, VINL, VADDL
Full
-
0.86
0.4
V
Input Current, IINH, IINL, IADDH,
IADDL
V+ = +4.5V, VINH = VADD = 0V or V+ (Note 10) Full
-0.5
-
0.5
A
DYNAMIC CHARACTERISTICS
Inhibit Turn-ON Time, tON
V+ = 3.9V, VAx or VBx = 3.0V, RL = 50, CL = 35pF,
25
-
24
34
ns
Full
-
38
ns
Inhibit Turn-OFF Time, tOFF
V+ = 3.9V, VAx or VBx = 3.0V, RL = 50, CL = 35pF,
25
-
14
24
ns
Full
-
28
ns
Address Transition Time, tTRANS
V+ = 3.9V, VAX or VBX = 3.0V, RL = 50, CL = 35pF,
25
-
21
31
ns
Full
-
34
ns
Break-Before-Make Time, tBBM
V+ = 4.5V, VAX or VBX = 3.0V, RL = 50, CL = 35pF,
25
-
4
-
ns
Full
1
-
ns
ISL43L841