4
FN6022.6
November 17, 2004
Absolute Maximum Ratings
Thermal Information
V+ to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to15V
Input Voltages
IN (Note 3). . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to ((V+) + 0.3V)
NO, NC (Note 3) . . . . . . . . . . . . . . . . . . . . . . -0.3 to ((V+) + 0.3V)
Output Voltages
COM (Note 3) . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to ((V+) + 0.3V)
Continuous Current (Any Terminal) . . . . . . . . . . . . . . . . . . . . . 30mA
Peak Current NO, NC, or COM
(Pulsed 1ms, 10% Duty Cycle, Max) . . . . . . . . . . . . . . . . . . 40mA
ESD Rating (Per MIL-STD-883 Method 3015). . . . . . . . . . . . . .>2kV
Operating Conditions
Temperature Range
ISL512XCX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C
ISL512XIX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to 85°C
Thermal Resistance (Typical, Note 4)
θJA (°C/W)
6 Ld SOT-23 Package . . . . . . . . . . . . . . . . . . . . . . .
230
8 Ld SOT-23 Package . . . . . . . . . . . . . . . . . . . . . . .
215
8 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . .
170
Maximum Junction Temperature (Plastic Package). . . . . . . . 150°C
Moisture Sensitivity (See Technical Brief TB363)
All Other Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Level 1
8 Ld SOT-23 Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . Level 2
Maximum Storage Temperature Range . . . . . . . . . . . . . -65°C to 150°C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300°C
(Lead Tips Only)
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
2. Signals on NC, NO, COM, or IN exceeding V+ or GND are clamped by internal diodes. Limit forward diode current to maximum current ratings.
3.
θJA is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
Electrical Specifications - 5V Supply
Test Conditions: V+ = +4.5V to +5.5V, GND = 0V, VINH = 2.4V, VINL = 0.8V (Note 5),
Unless Otherwise Specified
PARAMETER
TEST CONDITIONS
TEMP
(°C)
(NOTE 6)
MIN
TYP
(NOTE 6)
MAX
UNITS
ANALOG SWITCH CHARACTERISTICS
Analog Signal Range, VANALOG
Full
0
-
V+
V
ON Resistance, RON
V+ = 4.5V, ICOM = 1.0mA, VNO or VNC = 3.5V,
25
-
19
30
Full
-
23
40
RON Matching Between Channels,
RON
V+ = 5V, ICOM = 1.0mA, VNO or VNC= 3.5V
25
-
0.8
2
Full
-
1
4
RON Flatness, RFLAT(ON)
V+ = 5V, ICOM = 1.0mA, VNO or VNC = 1V, 2V, 3V
Full
-
7
8
NO or NC OFF Leakage Current,
INO(OFF) or INC(OFF)
V+ = 5.5V, VCOM = 1V, 4.5V, VNO or VNC = 4.5V, 1V,
(Note 7)
25
-0.1
0.01
0.1
nA
Full
-5
-
5
nA
COM OFF Leakage Current,
ICOM(OFF)
V+ = 5.5V, VCOM = 4.5V, 1V, VNO or VNC = 1V, 4.5V,
(Note 7)
25
-0.1
-
0.1
nA
Full
-5
-
5
nA
COM ON Leakage Current,
ICOM(ON)
V
+ = 5.5V, VCOM = 1V, 4.5V, or VNO or VNC = 1V, 4.5V,
or Floating, (Note 7)
25
-0.2
-
0.2
nA
Full
-10
-
10
nA
DYNAMIC CHARACTERISTICS
Turn-ON Time, tON
VNO or VNC = 3V, RL =1k, CL = 35pF, VIN = 0 to 3V,
25
-
28
75
ns
Full
-
40
150
ns
Turn-OFF Time, tOFF
VNO or VNC = 3V, RL =1k, CL = 35pF, VIN = 0 to 3V,
25
-
20
50
ns
Full
-
30
100
ns
Break-Before-Make Time Delay
(ISL5122, ISL5123), tD
RL = 300, CL = 35pF, VNO = VNC = 3V, VIN = 0 to 3V,
Full
3
10
-
ns
Charge Injection, Q
CL = 1.0nF, VG = 0V, RG = 0, (See Figure 2) 25
-
3
5
pC
OFF Isolation
RL = 50, CL = 5pF, f = 1MHz, (See Figure 4) 25
-
76
-
dB
Crosstalk (Channel-to-Channel)
RL = 50, CL = 5pF, f = 1MHz, (See Figure 6) 25
-
-105
-
dB
ISL5120, ISL5121, ISL5122, ISL5123