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參數(shù)資料
| 型號： | ISL54233IRTZ-T |
| 廠商： | Intersil |
| 文件頁數(shù)： | 2/18頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC MULTIPLEXER |
| 標準包裝： | 6,000 |
| 系列： | * |
ISL54233
10
FN7918.0
December 21, 2011
BOARD LAYOUT GUIDELINES
The ISL54233 device must be soldered directly onto the
PCB board. No IC sockets can be used. Their parasitic
impedance will degrade the frequency performance.
The signal traces (1D+, 1D-, 2D+, 2D-, 3D+, 3D-, COM- and
COM+) must have a controlled (characteristic) impedance of
50 ±5%
. Tight control on trace width and dielectric
thickness must be followed to get 50 lines. Impedance
tests results for controlled lines should be requested from
the board fabrication house.
A four layer PCB board: Signal (top) layer), Thin-Dielectric,
GND (2nd layer), Thick-Dielectric, GND (3rd layer),
Thin-Dielectric, Signal (Bottom layer) is required to achieve
50 traces. The top and bottom thin-dielectric are Nelco
4000-13 or Rogers 4350 core type material. The center
thick-dielectric is FR4 pre-preg material.
Figure 10 illustrates the material and sequencing of the
layers. The dimensions called out are those required to
achieve 50 microstrip for the signal traces.
Route all controlled impedance signal lines on the top
(signal) layer with no vias or through holes. Vias or through
holes make it difficult to maintain a controlled impedance
and tend to generate reflections.
The signal trace lengths should be as short ( <1 inch from
SMA connector to the switch pin) and straight as possible. If
it becomes necessary to turn 90°, use two 45° turns or an
arc instead of making a single 90° turn. This reduces
reflections on the signal by minimizing impedance
discontinuities.
Use Edge - Launch SMA connectors for all signal lines. The
SMA connector terminal should be tapered to the signal
trace.
Ground stitching should be done along signal traces and
around SMA ground connectors. This helps to isolate the
trace in a ground conduit. This reduces capacitive coupling
between traces and provides a good return path for the
signal.
Use dry film solder mask. Clear the solder mask from signal
trace.
Power and/or logic lines can be run on the bottom layer.
Logic lines should be routed away from the signal lines. This
will minimize capacitive coupling from the logic lines.
A 4.7F capacitor is placed from VCC to GND where the power
is brought onto the board. It keeps any low frequency noise
from getting on the board. Since a bulk capacitor will look
inductive at higher frequencies, an additional 0.1F capacitor
is placed across the supply lines. A 0.01F decoupling
capacitor needs to be connected from the VDD pin to ground
of the ISL54233 part to filter out any power supply noise from
entering the part. The capacitor should be a RF type chip
capacitor and should be located as close to the VDD pin as
possible. Note: RF type capacitors have a smaller foot-print
than regular capacitors.
FIGURE 10. FOUR LAYER BOARD STACK-UP
TOP (SIGNAL) LAYER
GND LAYER
FR4 PRE-PREG
GND LAYER
BOTTOM LAYER
5 mil
52 mil
5 mil
10 mil
ROGERS 4350 CORE
ROGERS 4350 CORE
TRACE
GND
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| ISL54233IRTZ-T7A | 制造商:Intersil Corporation 功能描述:USB 2.0 HS/UART, 12LD 3X3 TQFN IND, 250PS T&R - Tape and Reel 制造商:Intersil Corporation 功能描述:IC MULTIPLEXER 3:1 12TQFN 制造商:Intersil 功能描述:USB 2.0 HS/UART, 12L D 3x3 TQFN IND, 250 |
| ISL54233IRUZ-T | 功能描述:IC INTERFACE RoHS:是 類別:集成電路 (IC) >> 接口 - 模擬開關(guān)，多路復用器，多路分解器 系列:- 產(chǎn)品培訓模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標準包裝:36 系列:- 功能:多路復用器 電路:2 x 4:1 導通狀態(tài)電阻:75 歐姆 電壓電源:單/雙電源 電壓 - 電源，單路/雙路(±):2 V ~ 12 V，±2 V ~ 6 V 電流 - 電源:- 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:20-SOIC（0.295"，7.50mm 寬） 供應商設(shè)備封裝:20-SOIC W 包裝:管件 |
| ISL54233IRUZ-T7A | 功能描述:IC INTERFACE RoHS:是 類別:集成電路 (IC) >> 接口 - 模擬開關(guān)，多路復用器，多路分解器 系列:- 應用說明:Ultrasound Imaging Systems Application Note 產(chǎn)品培訓模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標準包裝:250 系列:- 功能:開關(guān) 電路:單刀單擲 導通狀態(tài)電阻:48 歐姆 電壓電源:單電源 電壓 - 電源，單路/雙路(±):2.7 V ~ 5.5 V 電流 - 電源:5µA 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:48-LQFP 供應商設(shè)備封裝:48-LQFP（7x7） 包裝:托盤 |
| ISL54301IRZ | 制造商:Intersil Corporation 功能描述:QUAD SPST WITH SERIAL INTERFACE, 4X4 QFN - Rail/Tube 制造商:Intersil 功能描述:QD SPST W/SERIAL INTERFACE 4X4 |
| ISL54301IRZ-T | 制造商:Intersil Corporation 功能描述:QUAD SPST WITH SERIAL INTERFACE, 4X4 QFN - Tape and Reel 制造商:Intersil 功能描述:QD SPST W/SERIAL INTERFACE 4X4 |
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