ISL76321
6
FN7803.1
December 23, 2013
Absolute Maximum Ratings
Thermal Information
Supply Voltage
VDD_P to GND_P, VDD_TX to GND_TX, VDD_IO to GND_IO . .-0.5V to 4.6V
VDD_CDR to GND_CDR, VDD_CR to GND_CR . . . . . . . . . . . . . . . . -0.5V to 2.5V
Between any pair of GND_
P, GND_TX, GND_IO, GND_CDR,
GND
_CR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-0.1V to 0.1V
3.3V Tolerant LVTTL/LVCMOS
Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to VDD_IO +0.3V
Differential Input Voltage . . . . . . . . . . . . . . . . . . . . .-0.3V to VDD_IO + 0.3V
Differential Output Current . . . . . . . . . . . . . . . . . . . . Short Circuit Protected
LVTTL/LVCMOS Outputs. . . . . . . . . . . . . . . . . . . . . . . Short Circuit Protected
ESD Rating
Human Body Model (Tested per JESD22-A114E)
All pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4kV
SERIOP/N
(All VDD Connected, all GND Connected) . . . . . . . . . . . . . . . . . . . . . . 8kV
Machine Model (Tested per JESD-A115-A) . . . . . . . . . . . . . . . . . . . . 200V
Charge Device Model (Tested per JESD22-C101C). . . . . . . . . . . . . 2000V
Latch Up (Tested per JESD-78B; Class2, Level A) . . . . . . . . . . . . . . . 100mA
Thermal Resistance (Typical)
θJA
θJC (°C/W)
QFN Package (Notes
6, 7) . . . . . . . . . . . . . .
32
3.7
Maximum Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 327mW
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . .+125°C
Maximum Storage Temperature Range . . . . . . . . . . . . . .-65°C to +150°C
Pb-Free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
Recommended Operating Conditions
Operating Temperature Range . . . . . . . . . . . . . . . . . . . . . .-40°C to +105°C
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product
reliability and result in failures not covered by warranty.
NOTES:
6.
θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech
Brief TB379.
7. For
θJC, the “case temp” location is the center of the exposed metal pad on the package underside.
Electrical Specifications Unless otherwise indicated, all data is for: VDD_CDR = VDD_CR = 1.8V, VDD_IO = 3.3V,
VDD_TX = VDD_P = VDD_AN = 3.3V, TA = +25°C, Ref_Res = 3.16kΩ, High-speed AC-coupling capacitor = 27nF. Boldface limits apply over the
operating temperature range, -40°C to +105°C.
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
POWER SUPPLY VOLTAGE
VDD_CDR, VDD_CR
1.7
1.8
1.9
V
VDD_TX, VDD_P, VDD_AN, VDD_IO
3.0
3.3
3.6
V
SERIALIZER POWER SUPPLY CURRENTS
Total 1.8V Supply Current
PCLK_IN = 45MHz
62
80
mA
Total 3.3V Supply Current
40
52
mA
DESERIALIZER POWER SUPPLY CURRENTS
Total 1.8V Supply Current
PCLK_IN = 45MHz
66
76
mA
Total 3.3V Supply Current
50
63
mA
POWER-DOWN SUPPLY CURRENT
Total 1.8V Power-Down Supply Current
RSTB = GND
10
mA
Total 3.3V Power-Down Supply Current
0.5
mA
PARALLEL INTERFACE
High Level Input Voltage
VIH
2.0
V
Low Level Input Voltage
VIL
0.8
V
Input Leakage Current
IIN
-1
±0.01
1
A
High Level Output Voltage
VOH
IOH = -4.0mA, VDD_IO = 3.0V
2.6
V
Low Level Output Voltage
VOL
IOL = 4.0mA, VDD_IO = 3.6V
0.4
V
Output Short Circuit Current
IOSC
35
mA