參數(shù)資料
型號: ISL90810WIU8Z
廠商: Intersil
文件頁數(shù): 5/11頁
文件大?。?/td> 0K
描述: IC XDCP 256-TAP 10KOHM 8-MSOP
標準包裝: 80
系列: XDCP™
接片: 256
電阻(歐姆): 10k
電路數(shù): 1
溫度系數(shù): 標準值 ±35 ppm/°C
存儲器類型: 易失
接口: I²C
電源電壓: 2.7 V ~ 5.5 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 8-TSSOP,8-MSOP(0.118",3.00mm 寬)
供應(yīng)商設(shè)備封裝: 8-MSOP
包裝: 管件
3
FN8234.2
November 10, 2006
Absolute Maximum Ratings
Thermal Information
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . .-65°C to +150°C
Voltage at Any Digital Interface Pin
With Respect to VSS . . . . . . . . . . . . . . . . . . . .-0.3V to VCC+0.3V
VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +6V
Voltage at Any DCP Pin With
Respect to VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to VCC
Lead Temperature (Soldering, 10s) . . . . . . . . . . . . . . . . . . . . +300°C
IW (10s) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±6mA
Latchup . . . . . . . . . . . . . . . . . . . . . . . . . Class II, Level A @ +105°C
ESD
HBM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6kV
MM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .500V
Thermal Resistance (Typical, Note 1)
θJA (°C/W)
8 Ld MSOP Package
130
Maximum Junction Temperature (Plastic Package . . . . . . . . +150°C
Recommended Operating Conditions
Industrial . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to +85°C
Automotive. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to +105°C
VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.7V to 5.5V
Power Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5mW
Wiper Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±3.0mA
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
1.
θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
Analog Specifications
Over recommended operating conditions unless otherwise stated.
SYMBOL
PARAMETER
TEST CONDITIONS
MIN
TYP
(Notes 2)
MAX
UNIT
RTOTAL
RH to RL Resistance
W, U versions respectively
10, 50
k
Ω
RH to RL Resistance Tolerance
-20
+20
%
RW
Wiper resistance
VCC = 3.3V @ +25°C
Wiper current = VCC/RTOTAL
70
200
Ω
CH/CL/CW
Potentiometer Capacitance
(Note 14, Equivalent circuitry)
10/10/25
pF
ILkgDCP
Leakage on DCP pins (Note 14)
Voltage at pin from GND to VCC
0.1
1
A
VOLTAGE DIVIDER MODE (0V @ RL; VCC @ RH; measured at RW, unloaded)
INL (Note 7)
Integral Non-Linearity
-1
1
LSB (Note 3)
DNL (Note 6)
Differential Non-Linearity
Monotonic over all tap positions
W option
-0.75
+0.75
LSB (Note 3)
U option
-0.5
+0.5
LSB (Note 3)
ZSerror (Note 4) Zero-Scale Error
W option
0
1
7
LSB (Note 3)
U option
0
0.5
2
FSerror (Note 5) Full-Scale Error
W option
-7
-1
0
LSB (Note 3)
U option
-2
-0.5
0
TCV (Notes 8, 14) Ratiometric Temperature Coefficient DCP Register set to 80 hex
±4
ppm/°C
RESISTOR MODE (Measurements between RW and RL with RH not connected, or between RW and RH with RL not connected)
RINL (Note 12)
Integral Non-Linearity
DCP register set between 20 hex and FF hex.
Monotonic over all tap positions
-1
1
MI (Note 9)
RDNL (Note 6)
Differential Non-Linearity
DCP register set between 20 hex
and FF hex. Monotonic over all tap
positions
W option
-0.75
+0.75
MI (Note 9)
U option
-0.5
+0.5
MI (Note 9)
Roffset (Note 10) Offset
W option
0
1
7
MI (Note 9)
U option
0
0.5
2
MI (Note 9)
TCR
(Notes 13, 14)
Resistance Temperature Coefficient DCP register set between 20 hex and FF hex
±35
ppm/°C
ISL90810
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