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| 型號： | ISL95810WIU8Z-T |
| 廠商： | Intersil |
| 文件頁數(shù)： | 5/13頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC XDCP 256-TAP 10KOHM 8-MSOP |
| 標準包裝： | 2,500 |
| 系列： | XDCP™ |
| 接片： | 256 |
| 電阻（歐姆）： | 10k |
| 電路數(shù)： | 1 |
| 溫度系數(shù)： | 標準值 ±45 ppm/°C |
| 存儲器類型： | 非易失 |
| 接口： | I²C |
| 電源電壓： | 2.7 V ~ 5.5 V |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 8-TSSOP，8-MSOP（0.118"，3.00mm 寬） |
| 供應(yīng)商設(shè)備封裝： | 8-MSOP |
| 包裝： | 帶卷 (TR) |
13
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
FN8090.2
September 19, 2006
ISL95810
Thin Dual Flat No-Lead Plastic Package (TDFN)
//
NX (b)
SECTION "C-C"
5
(A1)
BOTTOM VIEW
A
6
AREA
INDEX
C
0.10
0.08
SIDE VIEW
0.15
2X
E
A
B
C
0.15
D
TOP VIEW
CB
2X
6
8
AREA
INDEX
NX L
E2
E2/2
REF.
e
N
(Nd-1)Xe
(DATUM A)
(DATUM B)
5
0.10
8
7
D2
B
A
M C
N-1
12
PLANE
SEATING
C
A
A3
NX b
D2/2
NX k
FOR EVEN TERMINAL/SIDE
TERMINAL TIP
CL
e
L
C
L8.3x3B
8 LEAD THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE
SYMBOL
MILLIMETERS
NOTES
MIN
NOMINAL
MAX
A
0.70
0.75
0.80
-
A1
-
0.05
-
A3
0.20 REF
-
b
0.23
0.30
0.38
5, 8
D
3.00 BSC
-
D2
2.15
2.30
2.40
7, 8
E
3.00 BSC
-
E2
1.35
1.50
1.60
7, 8
e
0.65 BSC
-
k0.20
-
L
0.20
0.30
0.40
8
N8
2
Nd
4
3
Rev. 0 6/04
NOTES:
1. Dimensioning and tolerancing conform to ASME Y14.5-1994.
2. N is the number of terminals.
3. Nd refers to the number of terminals on D.
4. All dimensions are in millimeters. Angles are in degrees.
5. Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
7. Dimensions D2 and E2 are for the exposed pads which provide
improved electrical and thermal performance.
8. Nominal dimensions are provided to assist with PCB Land
Pattern Design efforts, see Intersil Technical Brief TB389.
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| ISL95811UFRTZ | 功能描述:IC POT 256TAPS 5BYTES 8-TDFN RoHS:是 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)字電位器 系列:XDCP™ 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標準包裝:2,500 系列:- 接片:256 電阻（歐姆）:100k 電路數(shù):2 溫度系數(shù):標準值 35 ppm/°C 存儲器類型:易失 接口:6 線串行（芯片選擇，遞增，增/減） 電源電壓:2.6 V ~ 5.5 V 工作溫度:-40°C ~ 125°C 安裝類型:表面貼裝 封裝/外殼:14-TSSOP（0.173"，4.40mm 寬） 供應(yīng)商設(shè)備封裝:14-TSSOP 包裝:帶卷 (TR) |
| ISL95811UFRTZ-TK | 功能描述:IC POT 256TAPS 5BYTES 8-TDFN RoHS:是 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)字電位器 系列:XDCP™ 標準包裝:3,000 系列:DPP 接片:32 電阻（歐姆）:10k 電路數(shù):1 溫度系數(shù):標準值 300 ppm/°C 存儲器類型:非易失 接口:3 線串行（芯片選擇，遞增，增/減） 電源電壓:2.5 V ~ 6 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:8-WFDFN 裸露焊盤 供應(yīng)商設(shè)備封裝:8-TDFN（2x3） 包裝:帶卷 (TR) |
| ISL95811UFUZ | 功能描述:IC POT 256TAPS 5BYTES 8-MSOP RoHS:是 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)字電位器 系列:XDCP™ 標準包裝:3,000 系列:DPP 接片:32 電阻（歐姆）:10k 電路數(shù):1 溫度系數(shù):標準值 300 ppm/°C 存儲器類型:非易失 接口:3 線串行（芯片選擇，遞增，增/減） 電源電壓:2.5 V ~ 6 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:8-WFDFN 裸露焊盤 供應(yīng)商設(shè)備封裝:8-TDFN（2x3） 包裝:帶卷 (TR) |
| ISL95811UFUZ-T | 功能描述:IC POT 256TAPS 5BYTES 8-MSOP RoHS:是 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)字電位器 系列:XDCP™ 標準包裝:3,000 系列:DPP 接片:32 電阻（歐姆）:10k 電路數(shù):1 溫度系數(shù):標準值 300 ppm/°C 存儲器類型:非易失 接口:3 線串行（芯片選擇，遞增，增/減） 電源電壓:2.5 V ~ 6 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:8-WFDFN 裸露焊盤 供應(yīng)商設(shè)備封裝:8-TDFN（2x3） 包裝:帶卷 (TR) |
| ISL95811UFUZ-TK | 功能描述:IC POT 256TAPS 5BYTES 8-MSOP RoHS:是 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)字電位器 系列:XDCP™ 標準包裝:3,000 系列:DPP 接片:32 電阻（歐姆）:10k 電路數(shù):1 溫度系數(shù):標準值 300 ppm/°C 存儲器類型:非易失 接口:3 線串行（芯片選擇，遞增，增/減） 電源電壓:2.5 V ~ 6 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:8-WFDFN 裸露焊盤 供應(yīng)商設(shè)備封裝:8-TDFN（2x3） 包裝:帶卷 (TR) |
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