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參數(shù)資料
| 型號： | ISP1160BM |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 總線控制器 |
| 英文描述： | Embedded Universal Serial Bus Host Controller |
| 中文描述： | UNIVERSAL SERIAL BUS CONTROLLER, PQFP64 |
| 封裝： | 7 X 7 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT-414-1, LQFP-64 |
| 文件頁數(shù)： | 86/88頁 |
| 文件大?。?/td> | 2044K |
| 代理商： | ISP1160BM |
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Philips Semiconductors
ISP1160
Embedded USB Host Controller
Product data
Rev. 04 — 04 July 2003
86 of 88
9397 750 11371
Koninklijke Philips Electronics N.V. 2003. All rights reserved.
[3]
These transparent plastic packages are extremely sensitive to reflow soldering conditions and must
on no account be processed through more than one soldering cycle or subjected to infrared reflow
soldering with peak temperature exceeding 217
°
C
±
10
°
C measured in the atmosphere of the reflow
oven. The package body peak temperature must be kept as low as possible.
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom
side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with
the heatsink on the top side, the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it
is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
[4]
[5]
[6]
[7]
22. Revision history
Table 77:
Rev Date
04
Revision history
CPCN
20030704
Description
Product data (9397 750 11371)
Modifications:
Table 1
: added type numbers /01
Table 2
: updated description for pin 40
Section 6
: changed active LOW pin names into NAME_N; also changed pin names in
figures and parameters in dynamic characteristics tables
Section 9.4.1
: removed the last bullet list under the examples on legal uses of the internal
FIFO buffer RAM
Section 9.5
: updated last paragraph
Table 8
: changed reset value to 10H
Table 9
: updated
Table 46
: updated the chip ID
Section 13
: added (new)
Table 68
: updated the table note
Deleted section Timing symbols (old section 17.1).
Product data (9397 750 10765)
Product data (9397 750 09628)
Objective data (9397 750 09161)
-
03
02
01
20030227
20020912
20020104
-
-
-
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| ISP1161ABM | Full-speed Universal Serial Bus single-chip host and device controller |
| ISP1161 | Full-speed Universal Serial Bus single-chip host and device controller |
| ISP1161A1 | Universal Serial Bus single-chip host and device controller |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| ISP1160BM,557 | 功能描述:USB 接口集成電路 USB 1.1 HOST CONTROLLER RoHS:否 制造商:Cypress Semiconductor 產(chǎn)品:USB 2.0 數(shù)據(jù)速率: 接口類型:SPI 工作電源電壓:3.15 V to 3.45 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:WLCSP-20 |
| ISP1160BM/01 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Embedded Universal Serial Bus Host Controller |
| ISP1160BM/01,118 | 功能描述:USB 接口集成電路 USB HOST CTRL RoHS:否 制造商:Cypress Semiconductor 產(chǎn)品:USB 2.0 數(shù)據(jù)速率: 接口類型:SPI 工作電源電壓:3.15 V to 3.45 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:WLCSP-20 |
| ISP1160BM/01,151 | 功能描述:USB 接口集成電路 DO NOT USE ORDER -T OR NO "-" RoHS:否 制造商:Cypress Semiconductor 產(chǎn)品:USB 2.0 數(shù)據(jù)速率: 接口類型:SPI 工作電源電壓:3.15 V to 3.45 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:WLCSP-20 |
| ISP1160BM/01,157 | 功能描述:USB 接口集成電路 USB FULL SPEED HOST RoHS:否 制造商:Cypress Semiconductor 產(chǎn)品:USB 2.0 數(shù)據(jù)速率: 接口類型:SPI 工作電源電壓:3.15 V to 3.45 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:WLCSP-20 |
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