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參數(shù)資料
| 型號： | K4H510438A-TLB0 |
| 廠商： | SAMSUNG SEMICONDUCTOR CO. LTD. |
| 英文描述： | Enclosures; For Use With:MNX Series Polycarbonate Enclosures; Approval Bodies:UL, CSA; External Height:5.8"; External Width:3.9"; Panel Height:5.8"; Panel Width:5.8"; Size/Dimensions:5.8 x 5.8; Enclosure Color:Silver |
| 中文描述： | 128MB DDR SDRAM的 |
| 文件頁數(shù)： | 21/24頁 |
| 文件大小： | 367K |
| 代理商： | K4H510438A-TLB0 |
Rev. 1.1 June. 2005
DDR SDRAM
DDR SDRAM 512Mb C-die (x4, x8, x16)
Figure 3. I/V characteristics for input/output buffers:Pull up(above) and pull down(below)
Maximum
Typical High
Minumum
Typical Low
Vout(V)
I
-220
-200
-180
-160
-140
-120
-100
-80
-60
-40
-20
0
0.0
1.0
2.0
Minimum
Typical Low
Typical High
Maximum
0
20
40
60
80
100
120
140
160
0.0
0.5
1.0
1.5
2.0
2.5
I
Vout(V)
Pullup Characteristics for Full Strength Output Driver
Pulldown Characteristics for Full Strength Output Driver
DDR SDRAM Output Driver V-I Characteristics
DDR SDRAM Output driver characteristics are defined for full and half strength operation as selected by the EMRS bit A1.
Figures 3 and 4 show the driver characteristics graphically, and tables 8 and 9 show the same data in tabular format suitable for input
into simulation tools. The driver characteristcs evaluation conditions are:
Typical
25×C
Vdd/Vddq = 2.5V, typical process
Minimum
70×C
Vdd/Vddq = 2.3V, slow-slow process
Maximum
0×C
Vdd/Vddq = 2.7V, fast-fast process
Output Driver Characteristic Curves Notes:
1. The full variation in driver current from minimum to maximum process, temperature and voltage will lie within the outer bounding lines
the of the V-I curve of Figure 3 and 4.
2. It is recommended that the "typical" IBIS V-I curve lie within the inner bounding lines of the V-I curves of Figure 3 and 4.
3. The full variation in the ratio of the "typical" IBIS pullup to "typical" IBIS pulldown current should be unity
+/-
10%, for device drain to
source voltages from 0.1 to1.0. This specification is a design objective only. It is not guaranteed.
23.0 IBIS : I/V Characteristics for Input and Output Buffers
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| K4H510438B-TCA0 | Enclosure; For Use With:PC17/16-L3, -3, -LFC3, FC3 Cardmaster Polycarbonate Enclosure; Approval Bodies:UL, CSA; External Height:5.4"; External Width:5.2"; Features:Impact Resistant EN 50102; UV Resistant to UL 508 |
| K4H510438B-TCA2 | Enclosure; For Use With:PC21/28-1 USA Cardmaster Polycarbonate Enclosure; Approval Bodies:UL, CSA; External Height:7.9"; External Width:5.6"; Features:Impact Resistant EN 50102; UV Resistant to UL 508 |
| K4H510438B-TCB0 | Enclosures; For Use With:PC30/25-1 USA Cardmaster Polycarbonate Enclosure; Approval Bodies:UL, CSA; External Height:11.4"; External Width:7.5"; Features:Impact Resistant EN 50102; UV Resistant to UL 508 RoHS Compliant: Yes |
| K4H510438B-TLA0 | Enclosures; For Use With:PC36/31-1 USA Cardmaster Polycarbonate Enclosure; Approval Bodies:UL, CSA; Features:Impact Resistant EN 50102; UV Resistant to UL 508; Approval Categories:Flammability Rated UL94-5V; Protection Rated IP65 |
| K4H510438B-TLA2 | 128Mb DDR SDRAM |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| K4H510438B-GC/LA2 | 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:512Mb B-die DDR SDRAM Specification |
| K4H510438B-GC/LB0 | 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:512Mb B-die DDR SDRAM Specification |
| K4H510438B-GC/LB3 | 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:512Mb B-die DDR SDRAM Specification |
| K4H510438B-GC/LCC | 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:512Mb B-die DDR SDRAM Specification |
| K4H510438B-TC/LA2 | 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:512Mb B-die DDR SDRAM Specification |
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