- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄373166 > KMM53632004BK (SAMSUNG SEMICONDUCTOR CO. LTD.) 32M x 36 DRAM SIMM Using 16Mx4 & 16Mx1 4K Refresh, 5V PDF資料下載
參數(shù)資料
| 型號： | KMM53632004BK |
| 廠商： | SAMSUNG SEMICONDUCTOR CO. LTD. |
| 英文描述： | 32M x 36 DRAM SIMM Using 16Mx4 & 16Mx1 4K Refresh, 5V |
| 中文描述： | 32M的× 36的DRAM上海藥物研究所利用16Mx4 |
| 文件頁數(shù)： | 1/19頁 |
| 文件大?。?/td> | 434K |
| 代理商： | KMM53632004BK |
DRAM MODULE
KMM53632004BK/BKG
KMM53632004BK/BKG EDO Mode
32M x 36 DRAM SIMM Using 16Mx4 & 16Mx1 4K Refresh, 5V
The Samsung KMM53632004B is a 32Mx36bits Dynamic
RAM high density memory module. The Samsung
KMM53632004B consists of sixteen CMOS 16Mx4bits and
eight CMOS 16Mx1bit DRAMs in SOJ packages mounted on
a 72-pin glass-epoxy substrate. A 0.1 or 0.22uF decoupling
capacitor is mounted on the printed circuit board for each
DRAM. The KMM53632004B is a Single In-line Memory Mod-
ule with edge connections and is intended for mounting into
72 pin edge connector sockets.
Part Identification
- KMM53632004BK(4K cycles/64ms Ref, SOJ, Solder)
- KMM53632004BKG(4K cycles/64ms Ref, SOJ, Gold)
Extended Out Data Mode Operation
CAS-before-RAS & Hidden Refresh capability
RAS-only refresh capability
TTL compatible inputs and outputs
Single +5V
±
10% power supply
JEDEC standard PDpin & pinout
PCB : Height(1420mil), double sided component
GENERAL DESCRIPTION
FEATURES
PERFORMANCE RANGE
Speed
t
RAC
t
CAC
t
RC
t
HPC
-5
50ns
13ns
84ns
20ns
-6
60ns
15ns
104ns
25ns
PIN NAMES
Pin Name
Function
A0 - A11
Address Inputs
DQ0 - 35
Data In/Out
W
Read/Write Enable
RAS0 - RAS3
Row Address Strobe
CAS0 - CAS3
Column Address Strobe
PD1 -PD4
Presence Detect
Vcc
Power(+5V)
Vss
Ground
NC
No Connection
PRESENCE DETECT PINS (Optional)
Pin
50NS
60NS
PD1
PD2
PD3
PD4
NC
Vss
Vss
Vss
NC
Vss
NC
NC
PIN CONFIGURATIONS
Pin
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
Symbol
V
SS
DQ0
DQ18
DQ1
DQ19
DQ2
DQ20
DQ3
DQ21
Vcc
NC
A0
A1
A2
A3
A4
A5
A6
A10
DQ4
DQ22
DQ5
DQ23
DQ6
DQ24
DQ7
DQ25
A7
A11
Vcc
A8
A9
RAS3
RAS2
DQ26
DQ8
Pin
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
Symbol
DQ17
DQ35
Vss
CAS0
CAS2
CAS3
CAS1
RAS0
RAS1
NC
W
NC
DQ9
DQ27
DQ10
DQ28
DQ11
DQ29
DQ12
DQ30
DQ13
DQ31
Vcc
DQ32
DQ14
DQ33
DQ15
DQ34
DQ16
NC
PD1
PD2
PD3
PD4
NC
Vss
SAMSUNG ELECTRONICS CO., LTD.
reserves the right to
change products and specifications without notice.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| KMM53632004CK | 32M x 36 DRAM SIMM Using 16Mx4 & 16Mx1 4K Refresh, 5V |
| KMM53632004BKG | 32M x 36 DRAM SIMM Using 16Mx4 & 16Mx1 4K Refresh, 5V |
| KMM53632004CKG | 32M x 36 DRAM SIMM Using 16Mx4 & 16Mx1 4K Refresh, 5V |
| KMM5364005BSWG | 4M x 36 DRAM SIMM Using 4Mx16 & Quad CAS 4Mx4, 4K Refresh, 5V |
| KMM5364005CSWG | 4M x 36 DRAM SIMM Using 4Mx16 & Quad CAS 4Mx4, 4K Refresh, 5V |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| KMM53632004BKG | 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:32M x 36 DRAM SIMM Using 16Mx4 & 16Mx1 4K Refresh, 5V |
| KMM53632004CK | 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:32M x 36 DRAM SIMM Using 16Mx4 & 16Mx1 4K Refresh, 5V |
| KMM53632004CKG | 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:32M x 36 DRAM SIMM Using 16Mx4 & 16Mx1 4K Refresh, 5V |
| KMM5364003BSW | 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:4M x 36 DRAM SIMM Using 4Mx16 & Quad CAS 4Mx4, 4K Refresh, 5V |
| KMM5364003BSWG | 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:4M x 36 DRAM SIMM Using 4Mx16 & Quad CAS 4Mx4, 4K Refresh, 5V |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。