參數(shù)資料
型號(hào): KMPC8313ECZQADDB
廠商: Freescale Semiconductor
文件頁(yè)數(shù): 19/99頁(yè)
文件大小: 0K
描述: IC MPU POWERQUICC II 516-PBGA
標(biāo)準(zhǔn)包裝: 2
系列: MPC83xx
處理器類型: 32-位 MPC83xx PowerQUICC II Pro
速度: 267MHz
電壓: 0.95 V ~ 1.05 V
安裝類型: 表面貼裝
封裝/外殼: 516-BBGA 裸露焊盤
供應(yīng)商設(shè)備封裝: 516-PBGAPGE(27x27)
包裝: 托盤
MPC8313E PowerQUICC II Pro Processor Hardware Specifications, Rev. 4
26
Freescale Semiconductor
8.2.1.4
RMII Receive AC Timing Specifications
This table provides the RMII receive AC timing specifications.
This table provides the AC test load.
Figure 12. AC Test Load
This table shows the RMII receive AC timing diagram.
Figure 13. RMII Receive AC Timing Diagram
Table 29. RMII Receive AC Timing Specifications
At recommended operating conditions with NVDD of 3.3 V ± 0.3 V.
Parameter/Condition
Symbol1
Min
Typ
Max
Unit
REF_CLK clock period
tRMX
—20—
ns
REF_CLK duty cycle
tRMXH/tRMX
35
65
%
RXD[1:0], CRS_DV, RX_ER setup time to REF_CLK
tRMRDVKH
4.0
ns
RXD[1:0], CRS_DV, RX_ER hold time to REF_CLK
tRMRDXKH
2.0
ns
REF_CLK clock rise VIL(min) to VIH(max)
tRMXR
1.0
4.0
ns
REF_CLK clock fall time VIH(max) to VIL(min)
tRMXF
1.0
4.0
ns
Note:
1. The symbols used for timing specifications follow the pattern of t(first three letters of functional block)(signal)(state)(reference)(state) for
inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tRMRDVKH symbolizes RMII
receive timing (RMR) with respect to the time data input signals (D) reach the valid state (V) relative to the tRMX clock
reference (K) going to the high (H) state or setup time. Also, tRMRDXKL symbolizes RMII receive timing (RMR) with respect
to the time data input signals (D) went invalid (X) relative to the tRMX clock reference (K) going to the low (L) state or hold
time. Note that, in general, the clock reference symbol representation is based on three letters representing the clock of a
particular functional. For example, the subscript of tRMX represents the RMII (RM) reference (X) clock. For rise and fall times,
the latter convention is used with the appropriate letter: R (rise) or F (fall).
Output
Z0 = 50
NVDD/2
RL = 50
REF_CLK
RXD[1:0]
tRMRDXKH
tRMX
tRMXH
tRMXR
tRMXF
CRS_DV
RX_ER
tRMRDVKH
Valid Data
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KMPC8313ECZQAFFB 功能描述:微處理器 - MPU 8313 REV2.1 Encyrpted RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
KMPC8313EVRADDB 功能描述:微處理器 - MPU 8313 REV2.1 W/ ENCR RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
KMPC8313EVRAFFB 功能描述:微處理器 - MPU 8313 REV2.1 W/ ENCR RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
KMPC8313EZQADDB 功能描述:微處理器 - MPU 8313 REV2.1 Encyrpted RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
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