參數(shù)資料
型號: KMPC8379CVRALG
廠商: Freescale Semiconductor
文件頁數(shù): 65/117頁
文件大?。?/td> 0K
描述: IC MPU POWERQUICC II 689-PBGA
標(biāo)準(zhǔn)包裝: 2
系列: MPC83xx
處理器類型: 32-位 MPC83xx PowerQUICC II Pro
速度: 667MHz
電壓: 1V
安裝類型: 表面貼裝
封裝/外殼: 689-BBGA 裸露焊盤
供應(yīng)商設(shè)備封裝: 689-TEPBGA II(31x31)
包裝: 托盤
MPC8379E PowerQUICC II Pro Processor Hardware Specifications, Rev. 8
Freescale Semiconductor
51
clock falling edge. Note that the internal clock which is guaranteed to be 50% duty cycle is used to sample
the data, and therefore used in the equations.
11.3.2.1
High-Speed Read Meeting Setup (Maximum Delay)
The following equations show how to calculate the allowed combined propagation delay range of the
SD_CLK and SD_DAT/CMD signals on the PCB.
tCLK_DELAY + tDATA_DELAY + tODLY + tSHSIVKH < 1.5 × tSHSCK
Eqn. 15
tCLK_DELAY + tDATA_DELAY < 1.5 × tSHSCK tODLY tSHSIVKH
Eqn. 16
This means that Data + Clock delay can be up to 11 ns for a 20 ns clock cycle:
tCLK_DELAY + tDATA_DELAY < 30 14 5
tCLK_DELAY + tDATA_DELAY < 11
11.3.2.2
High-Speed Read Meeting Hold (Minimum Delay)
The following equations show how to calculate the allowed combined propagation delay range of the
SD_CLK and SD_DAT/CMD signals on the PCB.
0.5
× tSHSCK < tCLK_DELAY + tDATA_DELAY + tOH tSHSIXKH + tINT_CLK_DLY
Eqn. 17
0.5
× tSHSCK tOH + tSHSIXKH tINT_CLK_DLY < tCLK_DELAY + tDATA_DELAY
Eqn. 18
This means that Data + Clock delay must be greater than ~6 ns for a 20 ns clock cycle:
10 2.5 + (–1.5) < tCLK_DELAY + tDATA_DELAY
6 < tCLK_DELAY + tDATA_DELAY
11.3.2.3
High-Speed Read Combined Formula
The following equation is the combined formula to calculate the propagation delay range of the SD_CLK
and SD_DAT/CMD signals on the PCB.
0.5
× tSHSCK tOH + tSHSIXKH < tCLK_DELAY + tDATA_DELAY < 1.5 × tSHSCK tODLY tSHSIVKH
Eqn. 19
12 JTAG
This section describes the DC and AC electrical specifications for the IEEE 1149.1 (JTAG) interface of
the chip.
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