參數(shù)資料
型號: KMPC8555VTAPF
廠商: Freescale Semiconductor
文件頁數(shù): 18/88頁
文件大?。?/td> 0K
描述: IC MPU POWERQUICC III 783-FCPBGA
標準包裝: 1
系列: MPC85xx
處理器類型: 32-位 MPC85xx PowerQUICC III
速度: 833MHz
電壓: 1.2V
安裝類型: 表面貼裝
封裝/外殼: 783-BBGA,F(xiàn)CBGA
供應(yīng)商設(shè)備封裝: 783-FCPBGA(29x29)
包裝: 托盤
MPC8555E PowerQUICC III Integrated Communications Processor Hardware Specification, Rev. 4.2
Freescale Semiconductor
25
Ethernet: Three-Speed, MII Management
8.2.2.1
GMII Receive AC Timing Specifications
Table 21 provides the GMII receive AC timing specifications.
Figure 8 provides the AC test load for TSEC.
Figure 8. TSEC AC Test Load
Figure 9 shows the GMII receive AC timing diagram.
Figure 9. GMII Receive AC Timing Diagram
Table 21. GMII Receive AC Timing Specifications
At recommended operating conditions with LVDD of 3.3 V ± 5%.
Parameter/Condition
Symbol 1
Min
Typ
Max
Unit
RX_CLK clock period
tGRX
—8.0
ns
RX_CLK duty cycle
tGRXH/tGRX
40
60
%
RXD[7:0], RX_DV, RX_ER setup time to RX_CLK
tGRDVKH
2.0
ns
RXD[7:0], RX_DV, RX_ER hold time to RX_CLK
tGRDXKH
0.5
ns
RX_CLK clock rise and fall time
tGRXR, tGRXF
2,3
——
1.0
ns
Note:
1. The symbols used for timing specifications herein follow the pattern of t(first two letters of functional block)(signal)(state)
(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tGRDVKH
symbolizes GMII receive timing (GR) with respect to the time data input signals (D) reaching the valid state (V) relative to
the tRX clock reference (K) going to the high state (H) or setup time. Also, tGRDXKL symbolizes GMII receive timing (GR)
with respect to the time data input signals (D) went invalid (X) relative to the tGRX clock reference (K) going to the low (L)
state or hold time. Note that, in general, the clock reference symbol representation is based on three letters representing
the clock of a particular functional. For example, the subscript of tGRX represents the GMII (G) receive (RX) clock. For rise
and fall times, the latter convention is used with the appropriate letter: R (rise) or F (fall).
2. Signal timings are measured at 0.7 V and 1.9 V voltage levels.
3. Guaranteed by design.
Output
Z0 = 50 Ω
LVDD/2
RL = 50 Ω
RX_CLK
RXD[7:0]
tGRDXKH
tGRX
tGRXH
tGRXR
tGRXF
tGRDVKH
RX_DV
RX_ER
相關(guān)PDF資料
PDF描述
IDT70V3379S4BF IC SRAM 576KBIT 4NS 208FBGA
KMPC8555VTALF IC MPU POWERQUICC III 783-FCPBGA
XCS20XL-5TQ144C IC FPGA 3.3V C-TEMP HP 144TQFP
65801-053LF CLINCHER RECEPTACLE ASSY GOLD
IDT70V3379S4BCG IC SRAM 576KBIT 4NS 256BGA
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
KMPC8555VTAQF 功能描述:IC MPU POWERQUICC III 783-FCPBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:MPC85xx 標準包裝:2 系列:MPC8xx 處理器類型:32-位 MPC8xx PowerQUICC 特點:- 速度:133MHz 電壓:3.3V 安裝類型:表面貼裝 封裝/外殼:357-BBGA 供應(yīng)商設(shè)備封裝:357-PBGA(25x25) 包裝:托盤
KMPC855TCVR50D4 功能描述:微處理器 - MPU POWER QUICC-NO LEAD RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
KMPC855TCVR66D4 功能描述:微處理器 - MPU POWER QUICC-NO LEAD RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
KMPC855TCZQ50D4 功能描述:微處理器 - MPU POWER QUICC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
KMPC855TCZQ66D4 功能描述:微處理器 - MPU POWER QUICC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324