SPI REQUIREMENTS FOR SDI/SDO MULTIPLEXED (READ OPER" />
參數(shù)資料
型號(hào): KSZ8051RNLI TR
廠商: Micrel Inc
文件頁數(shù): 5/59頁
文件大?。?/td> 0K
描述: TXRX PHY 10/T100 3.3V RMII 32QFN
特色產(chǎn)品: KSZ8051/8031/8021 Series
標(biāo)準(zhǔn)包裝: 1
類型: PHY 收發(fā)器
驅(qū)動(dòng)器/接收器數(shù): 1/1
規(guī)程: RMII
電源電壓: 1.8V,2.5V,3.3V
安裝類型: 表面貼裝
封裝/外殼: 32-VFQFN 裸露焊盤
供應(yīng)商設(shè)備封裝: 32-QFN(5x5)
包裝: 標(biāo)準(zhǔn)包裝
其它名稱: 576-3889-6
2008 Microchip Technology Inc.
DS22059B-page 13
MCP414X/416X/424X/426X
TABLE 1-3:
SPI REQUIREMENTS FOR SDI/SDO MULTIPLEXED (READ OPERATION ONLY) (2)
Characteristic
Symbol
Min
Max Units
Conditions
SCK Input Frequency
FSCK
—250
kHz
VDD= 2.7V to 5.5V
CS Active (VIL or VIHH) to SCK↑ input
TcsA2scH
60
ns
SCK input high time
TscH
1.8
us
SCK input low time
TscL
1.8
ns
Setup time of SDI input to SCK
↑ edge
TDIV2scH
40
ns
Hold time of SDI input from SCK
↑ edge
TscH2DIL40
ns
CS Inactive (VIH) to SDO output hi-impedance
TcsH2DOZ
50
ns
SDO data output valid after SCK
↓ edge
TscL2DOV—
1.6
us
SDO data output valid after
CS Active (VIL or VIHH)
TssL2doV
50
ns
CS Inactive (VIH) after SCK↓ edge
TscH2csI
100
ns
Hold time of CS Inactive (VIH) to
CS Active (VII or VIHH)
TcsA2csI
50
ns
Note 1:
This specification by design
2:
This table is for the devices where the SPI’s SDI and SDO pins are multiplexed (SDI/SDO) and a Read
command is issued. This is NOT required for SDI/SDO operation with the Increment, Decrement, or Write
commands. This data rate can be increased by having external pull-up resistors to increase the rising
edges of each bit.
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