參數(shù)資料
型號： KXPC8240RVV250E
廠商： Freescale Semiconductor
文件頁數(shù)： 44/52頁
文件大?。?/td> 0K
描述： IC MPU INTEGRATED 250MHZ 352TBGA
標(biāo)準(zhǔn)包裝： 2
系列： MPC82xx
處理器類型： 32-位 MPC82xx PowerQUICC II
速度： 250MHz
電壓： 2.5V
安裝類型： 表面貼裝
封裝/外殼： 352-LBGA
供應(yīng)商設(shè)備封裝： 352-TBGA（35x35）
包裝： 托盤
MPC8240 Integrated Processor Hardware Specifications
49
Ordering Information
1.9
Ordering Information
Ordering information for the parts fully covered by this specification document is provided in Section 1.9.1,
This Document,” lists the part numbers that do not fully conform to the specifications of this document.
These special part numbers require an additional document called a part number specification.
1.9.1
Part Numbers Fully Addressed by This Document
Table 20 provides the Motorola part numbering nomenclature for the MPC8240. Note that the individual
part numbers correspond to a maximum processor core frequency. For available frequencies, contact a local
Motorola sales office. Each part number also contains a revision code that refers to the die mask revision
number. The revision level can be determined by reading the Revision ID register at address offset 0x08.
1.9.2
Part Numbers Not Fully Addressed by This Document
Parts with application modifiers or revision levels not fully addressed in this specification document are
described in separate part number specifications that supplement and supersede this document. Table 21
shows the part numbers addressed by the XPC8240RXX250x part number specifications.
3
Throughout this document, the acronym EPIC was changed to PIC.
Throughout this document, the register name EICR was changed to ICR
Figure 2—The note numbers in the figure were renumbered to reflect the notes.
Table 7—Num 15 and 16 were updated, and Note 7 was corrected.
Figure 5 was updated to reflect the changes made in Table 7.
Section 1.7.6—Updated this section and Figure 23.
Section 1.9.1—Updated Table 20.
Section 1.9.2—Updated Table 21.
4
Section 1.4.1.2—Added Figure 4 and 5, Overshoot and Undershoot Voltage of PCI Interface
Section 1.5.1—Added solder ball package information for Lead free TBGA offering
Section 1.9—Added information regarding Lead free TBGA offering.
Table 20. Part Numbering Nomenclature
XPC
nnnn
x
xx
nnn
x
Product Code
Part Identifier
Process
Descriptor
Package 1
Processor
Frequency 2
Revision Level
XPC
8240
L = 2.5 V ± 125 mV
0 to 105
°C
ZU = TBGA
V V = Lead free
TBGA
200
E: 1.3, Revision ID 0x13
Notes:
1. See Section 1.5, “Package Description,” for more information on available package types.
2. Processor core frequencies supported by parts addressed by this specification only. Not all parts described in
this specification support all core frequencies. Additionally, parts addressed by part number specifications may
support other maximum core frequencies.
Table 19. Document Revision History (continued)
Revision
Number
Substantive Change(s)
F
re
e
sc
a
le
S
e
m
ic
o
n
d
u
c
to
r,
I
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
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.
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KXPC8250AZUPHBA 制造商:Motorola Inc 功能描述:
KXPC8255CVVIFBC 功能描述:微處理器 - MPU PQ 2 HIP 3 NO-PB RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
KXPC8255CZUIFBC 功能描述:微處理器 - MPU POWERQUICC II HIP3 REV C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
KXPC8255VVIFBC 功能描述:微處理器 - MPU PQ 2 HIP 3 NO-PB RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
KXPC8255ZUIFBC 功能描述:微處理器 - MPU POWERQUICC II HIP3 REV C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
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