參數(shù)資料
型號： LC5512MB-75FN256I
廠商： Lattice Semiconductor Corporation
文件頁數(shù)： 5/99頁
文件大小： 0K
描述： IC CPLD 512MACROCELLS 256FPBGA
標(biāo)準(zhǔn)包裝： 90
系列： ispXPLD® 5000MB
可編程類型： 系統(tǒng)內(nèi)可編程
最大延遲時(shí)間 tpd(1)： 7.5ns
電壓電源 - 內(nèi)部： 2.3 V ~ 2.7 V
邏輯元件/邏輯塊數(shù)目： 16
宏單元數(shù)： 512
輸入/輸出數(shù)： 193
工作溫度： -40°C ~ 105°C
安裝類型： 表面貼裝
封裝/外殼： 256-BGA
供應(yīng)商設(shè)備封裝： 256-FPBGA（17x17）
包裝： 托盤
Lattice Semiconductor
ispXPLD 5000MX Family Data Sheet
9
Table 4. MFB Memory Configuration
Input and Output
The data input and control signals to a MFB in memory mode are generated from inputs from the routing. Data sig-
nals are only available in the true non-inverted format. True or complemented versions of the inputs are available
for generating the control signals. Data and flag outputs are fed from the MFB to the GRP and OSA. Unused inputs
and outputs are not accessible in memory mode.
ROM Operation
In each of the memory modes it is possible to specify the power-on state of each bit in the memory array. This
allows the memory to be used as ROM if desired.
Increased Depth And Width
Designs that require a memory depth or width that is greater than that support by a single MFB can be supported
by cascading multiple blocks. For dual port, single port, and pseudo dual port modes additional width is easily pro-
vided by sharing address lines. Additional depth is supported by multiplexing the RAM output. For FIFO and CAM
modes additional width is supported through the cascading of MFBs.
The Lattice design tools automatically combine blocks to support the memory size specified in the user’s design.
Bus Size Matching
All of the memory modes apart from CAM mode support different widths on each of the ports. The RAM bits are
mapped LSB word 0 to MSB word 0, LSB word 1 to MSB word 1 and so on. Although the word size and number of
words for each port varies this mapping scheme applies to each port.
Memory Mode
Max. Configuration
Size
1
Dual-port
8,192 x 1
4,096 x 2
2,048 x 4
1,024 x 8
512 x 16
Single-port, Pseudo Dual Port, FIFO
16,384 x1
8,192 x 2
4,096 x 4
2,048 x 8
1,024 x 16
512 x 32
CAM
128 x 48
1. Smaller configurations are possible.
SELECT
DEVICES
DISCONTINUED
相關(guān)PDF資料
PDF描述
EEM02DRYN-S13 CONN EDGECARD 4POS .156 EXTENDER
GQM2195C2E5R6CB12D CAP CER 5.6PF 250V NP0 0805
LC5512MB-45FN256C IC CPLD 512MACROCELLS 256FPBGA
180-015-102L011 CONN DB15 MALE HD SOLDER CUP TIN
EMA43DRMD CONN EDGECARD 86POS .125 SQ WW
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
LC5512MB-75FN484C 功能描述:CPLD - 復(fù)雜可編程邏輯器件 PROGRAM EXPANDED LOG RoHS:否 制造商:Lattice 系列: 存儲類型:EEPROM 大電池?cái)?shù)量:128 最大工作頻率:333 MHz 延遲時(shí)間:2.7 ns 可編程輸入/輸出端數(shù)量:64 工作電源電壓:3.3 V 最大工作溫度:+ 90 C 最小工作溫度:0 C 封裝 / 箱體:TQFP-100
LC5512MB-75FN484I 功能描述:CPLD - 復(fù)雜可編程邏輯器件 PROGRAM EXPANDED LOG RoHS:否 制造商:Lattice 系列: 存儲類型:EEPROM 大電池?cái)?shù)量:128 最大工作頻率:333 MHz 延遲時(shí)間:2.7 ns 可編程輸入/輸出端數(shù)量:64 工作電源電壓:3.3 V 最大工作溫度:+ 90 C 最小工作溫度:0 C 封裝 / 箱體:TQFP-100
LC5512MB-75FN672C 制造商:LATTICE 制造商全稱:Lattice Semiconductor 功能描述:3.3V, 2.5V and 1.8V In-System Programmable eXpanded Programmable Logic Device XPLD⑩ Family
LC5512MB-75FN672I 制造商:LATTICE 制造商全稱:Lattice Semiconductor 功能描述:3.3V, 2.5V and 1.8V In-System Programmable eXpanded Programmable Logic Device XPLD⑩ Family
LC5512MB-75Q208C 功能描述:CPLD - 復(fù)雜可編程邏輯器件 PROGRAM EXPANDED LOG RoHS:否 制造商:Lattice 系列: 存儲類型:EEPROM 大電池?cái)?shù)量:128 最大工作頻率:333 MHz 延遲時(shí)間:2.7 ns 可編程輸入/輸出端數(shù)量:64 工作電源電壓:3.3 V 最大工作溫度:+ 90 C 最小工作溫度:0 C 封裝 / 箱體:TQFP-100
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。

采購需求

(若只采購一條型號，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進(jìn)入我的后臺，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進(jìn)入我的后臺，查看報(bào)價(jià)

*型號 *數(shù)量 廠商 批號 封裝
添加更多采購

我的聯(lián)系方式

*
*
*