參數(shù)資料
型號(hào): LH28F016SUT-10
廠商: Sharp Corporation
英文描述: 16M (1M x 16 , 2M x 8) Flash Memory
中文描述: 1,600(100萬(wàn)× 16,200萬(wàn)× 8)閃存
文件頁(yè)數(shù): 20/37頁(yè)
文件大?。?/td> 326K
代理商: LH28F016SUT-10
LH28F016SU
16M (1M × 16, 2M × 8) Flash Memory
20
DC Characteristics
V
CC
= 5.0 V ± 0.5 V, T
A
= 0°C to +70°C
3.5
Pin Set Low for 5 V Operations
SYMBOL
PARAMETER
TYP.
MIN.
MAX.
UNITS
TEST CONDITIONS
NOTE
I
IL
I
LO
Input Load Current
±1
μA
V
CC
= V
CC
MAX., V
IN
= V
CC
or GND
V
CC
= V
CC
MAX., V
IN
= V
CC
or GND
V
CC
= V
CC
MAX.,
CE
0
, CE
1
, RP
= V
CC
±0.2 V
BYTE, WP, 3/5
= V
CC
±0.2 V or
GND ±0.2 V
1
Output Leakage Current
±10
μA
1
I
CCS
V
CC
Standby Current
5
10
μA
1,4
2
4
mA
V
CC
= V
CC
MAX.,
CE
0
, CE
1
, RP
= V
IH
BYTE, WP, 3/5
= V
IH
or V
IL
I
CCD
V
CC
Deep Power-Down
Current
1
5
μA
RP
= GND ±0.2 V
1
I
CCR1
V
CC
Read Current
50
60
mA
V
CC
= V
CC
MAX.,
CMOS: CE
0
, CE
1
= GND ±0.2 V
BYTE = GND ±0.2 V or V
CC
±0.2 V
Inputs = GND ±0.2 V or V
CC
±0.2 V
TTL: CE
0
, CE
1
= V
IL,
BYTE = V
IH
or V
IL
Inputs = V
IL
or V
IH
f = 10 MHz, I
OUT
= 0 mA
V
CC
= V
CC
MAX.,
CMOS: CE
0
, CE
1
= GND ±0.2 V
BYTE = V
CC
±0.2 V or GND ±0.2 V
Inputs = GND ±0.2 V or V
CC
±0.2 V
TTL: CE
0
, CE
1
= V
IL,
BYTE = V
IH
or V
IL
Inputs = V
IL
or V
IH
f = 5 MHz, I
OUT
= 0 mA
Word/Byte Write in Progress
1, 3, 4
I
CCR2
V
CC
Read Current
30
35
mA
1, 3, 4
I
CCW
I
CCE
V
CC
Write Current
V
CC
Block Erase Current
25
35
mA
1
18
25
mA
Block Erase in Progress
1
I
CCES
V
CC
Erase Suspend
Current
5
10
mA
CE
0
, CE
1
= V
IH
Block Erase Suspended
1, 2
I
PPS
V
PP
Standby Current
V
PP
Deep Power-Down
Current
±10
μA
V
PP
V
CC
1
I
PPD
0.2
5
μA
RP
= GND ±0.2 V
1
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