參數(shù)資料
型號(hào): LMV1022UR
廠商: NATIONAL SEMICONDUCTOR CORP
元件分類: 音頻/視頻放大
英文描述: AUDIO PREAMPLIFIER, PBGA6
封裝: MICRO, SMD-6
文件頁(yè)數(shù): 18/18頁(yè)
文件大?。?/td> 623K
代理商: LMV1022UR
Application Section
The LMV1022 and LMV1023 consist of a pre-amplifier and
sigma-delta converter for placement inside an electret con-
denser microphone (ECM). The output of the LMV1022/
LMV1023 is a robust digital serial bit stream eliminating the
sensitive low-level analog signals of conventional JFET mi-
crophones. This application section describes, among others,
a typical application, a sensitivity comparison between differ-
ent ECM types, stereo operation and layout recommenda-
tions on the ECM PCBs.
TYPICAL APPLICATION
Figure 1 depicts a typical application, where the LMV1022 or
LMV1023 is built inside the ECM canister. This ECM can be
directly connected to a DSP in a digital audio system, like a
baseband chip in a cell phone. Connecting is easy because
of the digital LMV1022/ LMV1023 interface. A digital filter in
the DSP or Baseband decimates the audio signal.
20212424
FIGURE 1. Typical Application
LOW FREQUENCY CUT OFF FILTER
To reduce noise on the output of the microphone a low fre-
quency cut off filter has been implemented. This filter reduces
the effect of wind and handling noise. It's also helpful to re-
duce the proximity effect in directional microphones. This
effect occurs when the sound source is very close to the mi-
crophone. The air pressure wave results in very low frequen-
cy, large amplitude signals that when amplified gives a 'plop'
sound. This large signal can cause a temporary overload in
the amplifier, which results in distortion of the signal The cor-
ner frequency of the integrated high pass filter is linear pro-
portional to the input clock frequency of the part.
BUILT-IN PRE-AMPLIFIER / ADC
The LMV1022/ LMV1023 are offered in a space saving small
6-bump micro SMD package in order to fit inside small ECM
canisters. The LMV1022 or LMV1023 IC is placed on the
PCB. This PCB forms the bottom of the microphone, which is
placed in the device.
20212443
FIGURE 2. Built-in Pre-Amplifier / ADC
Figure 3 depicts a cross section of a microphone with the IC
inside the ECM canister. The PCB of the microphone has 4
pads that connects V
DD, Ground, DATA and the CLOCK.
9
www.national.com
202124 Version 2 Revision 1
Print Date/Time: 2011/07/08 14:36:52
LMV1022/LMV1023
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