參數(shù)資料
型號: LPC3240FET296/01,5
廠商: NXP Semiconductors
文件頁數(shù): 34/57頁
文件大?。?/td> 0K
描述: IC ARM9 MCU 256K 296-TFBGA
標(biāo)準(zhǔn)包裝: 126
系列: LPC3200
核心處理器: ARM9
芯體尺寸: 16/32-位
速度: 266MHz
連通性: EBI/EMI,以太網(wǎng),I²C,IrDA,Microwire,SPI,SSI,SSP,UART/USART,USB OTG
外圍設(shè)備: DMA,I²S,電機(jī)控制 PWM,PWM,WDT
輸入/輸出數(shù): 51
程序存儲器類型: ROMless
RAM 容量: 256K x 8
電壓 - 電源 (Vcc/Vdd): 0.9 V ~ 3.6 V
數(shù)據(jù)轉(zhuǎn)換器: A/D 3x10b
振蕩器型: 內(nèi)部
工作溫度: -40°C ~ 85°C
封裝/外殼: 296-TFBGA
包裝: 托盤
其它名稱: 568-4963
935290765551
LPC3220_30_40_50
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 2 — 20 October 2011
4 of 79
NXP Semiconductors
LPC3220/30/40/50
16/32-bit ARM microcontrollers
4.
Ordering information
[1]
F =
40 C to +85 C temperature range. Note that Revision “A” parts with and without the /01 suffix are identical. For example,
LPC3220FET296 Revision “A” is identical to LPC3220FET296/01 Revision “A”.
[2]
Available starting with Revision “A”.
4.1 Ordering options
Table 1.
Ordering information
Type number[1]
Package
Name
Description
Version
LPC3220FET296/01[2]
TFBGA296
plastic thin fine-pitch ball grid array package; 296 balls SOT1048-1
LPC3230FET296/01[2]
TFBGA296
plastic thin fine-pitch ball grid array package; 296 balls SOT1048-1
LPC3240FET296/01[2]
TFBGA296
plastic thin fine-pitch ball grid array package; 296 balls SOT1048-1
LPC3250FET296/01[2]
TFBGA296
plastic thin fine-pitch ball grid array package; 296 balls SOT1048-1
Table 2.
Part options
Type number
SRAM (kB)
10/100 Ethernet
LCD
controller
Temperature range (
C)
Package
LPC3220FET296/01
128
0
40 to +85
TFBGA296
LPC3230FET296/01
256
0
1
40 to +85
TFBGA296
LPC3240FET296/01
256
1
0
40 to +85
TFBGA296
LPC3250FET296/01
256
1
40 to +85
TFBGA296
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