參數(shù)資料
型號(hào)： LRS1360C
英文描述： MIXED MEMORY|SRAM+EEPROM|HYBRID|BGA|72PIN|PLASTIC
中文描述： 混合存儲(chǔ)器|靜態(tài)存儲(chǔ)器EEPROM中|混合|的BGA | 72PIN |塑料
文件頁(yè)數(shù)： 8/43頁(yè)
文件大小： 1326K
代理商： LRS1360C
LRS1382
6
3.2 Simultaneous Operation Modes Allowed with Four Planes
(1, 2)
Notes:
1. “X” denotes the operation available.
2. Configurative Partition Dual Work Restrictions:
Status register reflects partition state, not WSM (Write State Machine) state - this allows a status register for each partition.
Only one partition can be erased or programmed at a time - no command queuing.
Commands must be written to an address within the block targeted by that command.
IF ONE
PARTITION IS:
THEN THE MODES ALLOWED IN THE OTHER PARTITION IS:
Read
Array
Read
ID
Read
Status
Read
Query
Word
Program
Page
Buffer
Program
X
Block
Erase
Full Chip
Erase
Program
Suspend
Block
Erase
Suspend
X
Read Array
X
X
X
X
X
X
X
Read ID
Read Status
Read Query
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
Word Program
Page Buffer
Program
Block Erase
X
X
X
X
X
X
X
X
X
X
X
X
X
X
Full Chip Erase
Program
Suspend
Block Erase
Suspend
X
X
X
X
X
X
X
X
X
X
X
X
X
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參數(shù)描述
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LRS1370 制造商:Sharp Microelectronics Corporation 功能描述:COMBO 1MX16 FLASH + 128KX16 SRAM 2.7V TO 3.6V 72CSP - Trays
LRS1380 制造商:SANYO 制造商全稱:Sanyo Semicon Device 功能描述:STACKED CHIP 32M (X 16) FLASH AND 4M (X 16) SRAM
LRS1380J 制造商:SHARP 制造商全稱:Sharp Electrionic Components 功能描述:STACKED CHIP 32M (X 16) BOOT BLOCK FLASH AND 4M (X 16) SRAM
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