
High Current Jumper Chip
LRZ Series
High current zero-Ohm link
Thick film copper technology
Current rating to 35A
Typical resistance 1.5m
Inductance below 0.2nH
General Note
Welwyn Components reserves the right to make changes in product specification without notice or liability.
All information is subject to Welwyn’s own data and is considered accurate at time of going to print.
Welwyn Components Limited
· Bedlington, Northumberland NE22 7AA, UK
Telephone: +44 (0) 1670 822181 · Facsimile: +44 (0) 1670 829465 · Email: info@welwyn-tt.com · Website: www.welwyn-tt.com
Electrical Data
Issue B · 02.05
A subsidiary of
TT electronics plc
Physical Data
Size
0805
1206
2010
2512
Notes
Current rating @ 70 °C
Amps
15
20
30
35
DC or AC rms
2 second overload current @ 25oC
Amps
30
40
60
70
Resistance
Ohms
0.003 max.
0.0015 typ.
Ambient temperature range
°C
-55 to +150
Dielectric withstand voltage
Volts
200
Temperature rise at rated current
oC
30
40
80
90
Pad & trace area for rated current
mm
2
40
50
100
300
See Application Notes
Dimensions (mm) & Weight (g)
L
W
T
A
C
Wt
0805
2.0 ± 0.3
1.25 ± 0.2
0.61 ± 0.1
0.3 ± 0.15
0.3 ± 0.1
0.009
1206
3.20 ± 0.31
1.63 ± 0.2
0.61 ± 0.1
0.48 ± 0.25
0.48 ± 0.25
0.020
2010
5.23 ± 0.38
2.64 ± 0.25
0.74 ± 0.1
0.48 ± 0.25
0.48 ± 0.25
0.036
2512
6.5 ± 0.38
3.25 ± 0.25
0.74 ± 0.1
0.48 ± 0.25
0.48 ± 0.25
0.055
T
W
A
A
L
Wrap-around terminations
(3 faces)
C
Construction
A thick film copper conductive element and organic
protection are screen printed on a 96% alumina substrate.
Terminations
The wrap-around copper terminations have an electroplated
nickel barrier and solderable coating, which ensures excellent
‘leach’ resistance properties and solderability. Chips can
withstand immersion in solder at 260C for 30 seconds and
are suitable for reflow or wave soldering processes.
Marking
The body protection is resistant to all normal cleaning solvents
suitable for printed circuits. Chips are marked R000 except for
0805 size which are not marked.
Welwyn Components