參數(shù)資料
型號(hào): LT1010CT#31
廠商: Linear Technology
文件頁數(shù): 9/20頁
文件大?。?/td> 0K
描述: IC BUFFER HI-SPEED 150MA TO220-5
標(biāo)準(zhǔn)包裝: 50
放大器類型: 緩沖器
電路數(shù): 1
轉(zhuǎn)換速率: 75 V/µs
增益帶寬積: 20MHz
電流 - 輸入偏壓: 500µA
電流 - 電源: 5mA
電流 - 輸出 / 通道: 150mA
電壓 - 電源,單路/雙路(±): 4.5 V ~ 40 V,±2.25 V ~ 20 V
工作溫度: 0°C ~ 100°C
安裝類型: 通孔
封裝/外殼: TO-220-7 成形引線
供應(yīng)商設(shè)備封裝: TO-220-5
包裝: 管件
其它名稱: LT1010CT-FLOW31
LT1010CT-FLOW31-ND
Q1102103
LT1010
17
1010fe
PACKAGE DESCRIPTION
3.00
±0.10
(4 SIDES)
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON TOP AND BOTTOM OF PACKAGE
0.40
± 0.10
BOTTOM VIEW—EXPOSED PAD
1.65
± 0.10
(2 SIDES)
0.75
±0.05
R = 0.125
TYP
2.38
±0.10
1
4
8
5
PIN 1
TOP MARK
(NOTE 6)
0.200 REF
0.00 – 0.05
(DD8) DFN 0509 REV C
0.25
± 0.05
2.38
±0.05
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
1.65
±0.05
(2 SIDES)
2.10
±0.05
0.50
BSC
0.70
±0.05
3.5
±0.05
PACKAGE
OUTLINE
0.25
± 0.05
0.50 BSC
DD Package
8-Lead Plastic DFN (3mm
× 3mm)
(Reference LTC DWG # 05-08-1698 Rev C)
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