參數(shù)資料
型號: LT1101ISW#TRPBF
廠商: Linear Technology
文件頁數(shù): 7/16頁
文件大小: 0K
描述: IC PREC INSTRMNT-AMP SNGL 16SOIC
標(biāo)準(zhǔn)包裝: 1,000
放大器類型: 儀表
電路數(shù): 1
轉(zhuǎn)換速率: 0.1 V/µs
增益帶寬積: 37kHz
電流 - 輸入偏壓: 6nA
電壓 - 輸入偏移: 250µV
電流 - 電源: 94µA
電壓 - 電源,單路/雙路(±): 2.2 V ~ 36 V,±1.1 V ~ 18 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 16-SOIC(0.295",7.50mm 寬)
供應(yīng)商設(shè)備封裝: 16-SO
包裝: 帶卷 (TR)
15
LT1101
1101fa
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
U
PACKAGE DESCRIPTIO
H Package
8-Lead TO-5 Metal Can (.200 Inch PCD)
(Reference LTC DWG # 05-08-1320)
.050
(1.270)
MAX
.016 – .021**
(0.406 – 0.533)
.010 – .045*
(0.254 – 1.143)
SEATING
PLANE
.040
(1.016)
MAX
.165 – .185
(4.191 – 4.699)
GAUGE
PLANE
REFERENCE
PLANE
.500 – .750
(12.700 – 19.050)
.305 – .335
(7.747 – 8.509)
.335 – .370
(8.509 – 9.398)
DIA
.200
(5.080)
TYP
.027 – .045
(0.686 – 1.143)
.028 – .034
(0.711 – 0.864)
.110 – .160
(2.794 – 4.064)
INSULATING
STANDOFF
45°TYP
H8(TO-5) 0.200 PCD 0801
LEAD DIAMETER IS UNCONTROLLED BETWEEN THE REFERENCE PLANE
AND THE SEATING PLANE
FOR SOLDER DIP LEAD FINISH, LEAD DIAMETER IS
.016 – .024
(0.406 – 0.610)
*
**
PIN 1
OBSOLETE PACKAGES
J8 0801
.014 – .026
(0.360 – 0.660)
.200
(5.080)
MAX
.015 – .060
(0.381 – 1.524)
.125
3.175
MIN
.100
(2.54)
BSC
.300 BSC
(7.62 BSC)
.008 – .018
(0.203 – 0.457)
0° – 15°
.005
(0.127)
MIN
.405
(10.287)
MAX
.220 – .310
(5.588 – 7.874)
12
3
4
87
65
.025
(0.635)
RAD TYP
.045 – .068
(1.143 – 1.650)
FULL LEAD
OPTION
.023 – .045
(0.584 – 1.143)
HALF LEAD
OPTION
CORNER LEADS OPTION
(4 PLCS)
.045 – .065
(1.143 – 1.651)
NOTE: LEAD DIMENSIONS APPLY TO SOLDER DIP/PLATE
OR TIN PLATE LEADS
J8 Package
8-Lead CERDIP (Narrow .300 Inch, Hermetic)
(Reference LTC DWG # 05-08-1110)
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