參數(shù)資料
型號: LT1207CS
廠商: Linear Technology
文件頁數(shù): 4/16頁
文件大?。?/td> 0K
描述: IC CURRNT FEEDBK AMP DUAL 16SOIC
標準包裝: 50
放大器類型: 電流反饋
電路數(shù): 2
轉(zhuǎn)換速率: 900 V/µs
-3db帶寬: 60MHz
電流 - 輸入偏壓: 10µA
電壓 - 輸入偏移: 3000µV
電流 - 電源: 20mA
電流 - 輸出 / 通道: 1.2A
電壓 - 電源,單路/雙路(±): 10 V ~ 30 V,±5 V ~ 15 V
工作溫度: 0°C ~ 70°C
安裝類型: 表面貼裝
封裝/外殼: 16-SOIC(0.154",3.90mm 寬)
供應商設備封裝: 16-SO
包裝: 管件
12
LT1207
resistance between the layer is small. Copper board stiff-
eners and plated through holes can also be used to spread
the heat generated by the device.
Table 1 lists thermal resistance for several different board
sizes and copper areas. All measurements were taken in
still air on 3/32" FR-4 board with 2oz copper. This data can
be used as a rough guideline in estimating thermal resis-
tance. The thermal resistance for each application will be
affected by thermal interactions with other components as
well as board size and shape.
Table 1. Fused 16-Lead SO Package
TOTAL
THERMAL RESISTANCE
TOPSIDE
BACKSIDE
COPPER AREA (JUNCTION-TO-AMBIENT)
2500 sq. mm
5000 sq. mm
40
°C/W
1000 sq. mm
2500 sq. mm
3500 sq. mm
46
°C/W
600 sq. mm
2500 sq. mm
3100 sq. mm
48
°C/W
180 sq. mm
2500 sq. mm
2680 sq. mm
49
°C/W
180 sq. mm
1000 sq. mm
1180 sq. mm
56
°C/W
180 sq. mm
600 sq. mm
780 sq. mm
58
°C/W
180 sq. mm
300 sq. mm
480 sq. mm
59
°C/W
180 sq. mm
100 sq. mm
280 sq. mm
60
°C/W
180 sq. mm
0 sq. mm
180 sq. mm
61
°C/W
where:
TJ = Junction Temperature
TA = Ambient Temperature
PD = Device Dissipation
θJA = Thermal Resistance (Junction-to-Ambient)
As an example, calculate the junction temperature for the
circuit in Figure 8 assuming a 70
°C ambient temperature.
The device dissipation can be found by measuring the
supply currents, calculating the total dissipation and then
subtracting the dissipation in the load and feedback
network.
U
S
A
O
PPLICATI
WU
U
I FOR ATIO
The dissipation for each amplifier is:
PD = (37.5mA)(30V) – (12V)
2/(1k||1k) = 0.837W
The total dissipation is PD = 1.674W. When a 2500 sq mm
PC board with 2oz copper on top and bottom is used, the
thermal resistance is 40
°C/W.ThejunctiontemperatureTJis:
TJ = (1.674W)(40°C/W) + 70°C = 137°C
The maximum junction temperature for the LT1207 is
150
°C, so the heat sinking capability of the board is
adequate for the application.
If the copper area on the PC board is reduced to 280mm2
the thermal resistance increases to 60
°C/W and the junc-
tion temperature becomes:
TJ = (1.674W)(60°C/W) + 70°C = 170°C
Which is above the maximum junction temperature indi-
cating that the heat sinking capability of the board is
inadequate and should be increased.
COPPER AREA (2oz)
COPPER AREA (mm2)
0
THERMAL
RESISTANCE
(
°C/W)
70
60
50
40
30
20
10
0
LT1207 F07
2000
5000
1000
3000
4000
Figure 7. Thermal Resistance vs Total Copper Area
(Top + Bottom)
Calculating Junction Temperature
The junction temperature can be calculated from the
equation:
TJ = (PD)(θJA) + TA
+
15V
–15V
0.01
F
1k
330
1k
200pF
–12V
12V
f = 2MHz
37.5mA
I
LT1206 F07
1/2 LT1207
SHDN
Figure 8. Thermal Calculation Example
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LT1207CS#PBF 功能描述:IC CURRNT FEEDBK AMP DUAL 16SOIC RoHS:是 類別:集成電路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 標準包裝:2,500 系列:Excalibur™ 放大器類型:J-FET 電路數(shù):1 輸出類型:- 轉(zhuǎn)換速率:45 V/µs 增益帶寬積:10MHz -3db帶寬:- 電流 - 輸入偏壓:20pA 電壓 - 輸入偏移:490µV 電流 - 電源:1.7mA 電流 - 輸出 / 通道:48mA 電壓 - 電源,單路/雙路(±):4.5 V ~ 38 V,±2.25 V ~ 19 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:8-SOIC(0.154",3.90mm 寬) 供應商設備封裝:8-SOIC 包裝:帶卷 (TR)
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